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In: Anti-Corrosion Methods and Materials, Jg. 46 (1999-04-01), Heft 2, S. 122-126Online academicJournalZugriff:
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In: Assembly Automation, Jg. 23 (2003-06-01), Heft 2Online academicJournalZugriff:
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In: Assembly Automation, Jg. 23 (2003-03-01), Heft 1Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 48 (2001-10-01), Heft 5Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 47 (2000-12-01), Heft 6Online academicJournalZugriff:
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In: Soldering & Surface Mount Technology, Jg. 12 (2000-04-01), Heft 1Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 46 (1999-10-01), Heft 5Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 46 (1999-04-01), Heft 2Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 60 (2013-09-09), Heft 5Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 60 (2013-09-06), Heft 5Online academicJournalZugriff:
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In: Circuit World, Jg. 39 (2013-08-16), Heft 3Online academicJournalZugriff:
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In: Microelectronics International, Jg. 30 (2013-07-29), Heft 3Online academicJournalZugriff:
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In: Microelectronics International: An International Journal, Jg. 30 (2013-07-26), Heft 3Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 60 (2013-03-15), Heft 2Online academicJournalZugriff:
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In: Circuit World, Jg. 38 (2012-08-17), Heft 3Online academicJournalZugriff:
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In: Circuit World, Jg. 37 (2011-11-22), Heft 4Online academicJournalZugriff:
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IC Package Innovation: Choosing the Right Solution TWI, Granta Park, Abington, Cambridge 26 May 2011In: Microelectronics International: An International Journal, Jg. 28 (2011-08-02), Heft 3Online academicJournalZugriff:
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In: Soldering & Surface Mount Technology, Jg. 17 (2005-12-01), Heft 4Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 52 (2005-10-01), Heft 5Online academicJournalZugriff:
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In: Anti-Corrosion Methods and Materials, Jg. 52 (2005-02-01), Heft 1Online academicJournalZugriff: