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Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- components, circuits, devices and systems 16 Treffer
- engineered materials, dielectrics and plasmas 16 Treffer
- capacitors 8 Treffer
- capacitance 5 Treffer
- annealing 4 Treffer
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45 weitere Werte:
- ferroelectric materials 4 Treffer
- films 4 Treffer
- substrates 4 Treffer
- conductivity 3 Treffer
- crystallization 3 Treffer
- crystals 3 Treffer
- degradation 3 Treffer
- ferroelectric films 3 Treffer
- fields, waves and electromagnetics 3 Treffer
- lattices 3 Treffer
- leakage current 3 Treffer
- lithium niobate 3 Treffer
- nonvolatile memory 3 Treffer
- photonics and electrooptics 3 Treffer
- random access memory 3 Treffer
- resonant frequency 3 Treffer
- silicon 3 Treffer
- sputtering 3 Treffer
- barium strontium titanate (bst) 2 Treffer
- coatings 2 Treffer
- couplings 2 Treffer
- fabrication 2 Treffer
- fatigue 2 Treffer
- impedance 2 Treffer
- power, energy and industry applications 2 Treffer
- resonators 2 Treffer
- semiconductor thin films 2 Treffer
- temperature 2 Treffer
- temperature sensors 2 Treffer
- 5g 1 Treffer
- amorphous materials 1 Treffer
- bandwidth 1 Treffer
- bioengineering 1 Treffer
- bst 1 Treffer
- buffer layers 1 Treffer
- chemical solution deposition 1 Treffer
- communication, networking and broadcast technologies 1 Treffer
- conductive films 1 Treffer
- cooling 1 Treffer
- copper 1 Treffer
- costs 1 Treffer
- critical current 1 Treffer
- cryogenic 1 Treffer
- cryogenics 1 Treffer
- current measurement 1 Treffer
Publikation
- 2007 sixteenth ieee international symposium on the applications of ferroelectrics, applications of ferroelectrics, 2007. isaf 2007. sixteenth ieee international symposium on 2 Treffer
- ieee transactions on components, packaging and manufacturing technology, components, packaging and manufacturing technology, ieee transactions on, ieee trans. compon., packag. manufact. technol. 2 Treffer
- 2001 6th international conference on solid-state and integrated circuit technology. proceedings (cat. no.01ex443), solid-state and integrated-circuit technology, 2001. proceedings. 6th international conference on, solid-state and integrated circuit technology 1 Treffer
- 2011 12th international conference on electronic packaging technology and high density packaging, electronic packaging technology and high density packaging (icept-hdp), 2011 12th international conference on 1 Treffer
- 2011 ieee 61st electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2011 ieee 61st 1 Treffer
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13 weitere Werte:
- 2016 joint ieee international symposium on the applications of ferroelectrics, european conference on application of polar dielectrics, and piezoelectric force microscopy workshop (isaf/ecapd/pfm), applications of ferroelectrics, european conference on application of polar dielectrics, and piezoelectric force microscopy workshop (isaf/ecapd/pfm), 2016 joint ieee international symposium on the 1 Treffer
- 2017 joint ieee international symposium on the applications of ferroelectric (isaf)/international workshop on acoustic transduction materials and devices (iwatmd)/piezoresponse force microscopy (pfm), applications of ferroelectric (isaf)/international workshop on acoustic transduction materials and devices (iwatmd)/piezoresponse force microscopy (pfm), 2017 joint ieee international symposium on the 1 Treffer
- 2019 ieee 69th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2019 ieee 69th 1 Treffer
- 2019 ieee international ultrasonics symposium (ius), ultrasonics symposium (ius), 2019 ieee international 1 Treffer
- 2021 ieee mtt-s international microwave filter workshop (imfw), microwave filter workshop (imfw), 2021 ieee mtt-s international 1 Treffer
- 50th annual device research conference, device research conference, 1992. digest. 50th annual 1 Treffer
- ieee electron device letters, electron device letters, ieee, ieee electron device lett. 1 Treffer
- ieee transactions on applied superconductivity, applied superconductivity, ieee transactions on, ieee trans. appl. supercond. 1 Treffer
- ieee transactions on plasma science, plasma science, ieee transactions on, ieee trans. plasma sci. 1 Treffer
- international electron devices meeting. technical digest (cat. no.01ch37224), electron devices meeting, 2001. iedm '01. technical digest. international, electron devices meeting 2001 1 Treffer
- isaf '96. proceedings of the tenth ieee international symposium on applications of ferroelectrics, applications of ferroelectrics, 1996. isaf '96., proceedings of the tenth ieee international symposium on, ferroelectrics applications 1 Treffer
- journal of microelectromechanical systems, microelectromechanical systems, journal of, j. microelectromech. syst. 1 Treffer
- proceedings of the ieee 2002 custom integrated circuits conference (cat. no.02ch37285), custom integrated circuits conference, 2002. proceedings of the ieee 2002, custom integrated circuits conference 1 Treffer
20 Treffer
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In: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019-05-01, S. 1647-1652KonferenzZugriff:
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In: 2021 IEEE MTT-S International Microwave Filter Workshop (IMFW), 2021-11-17, S. 112-114KonferenzZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 6 (2016-10-01), Heft 10, S. 1561-1566Online academicJournalZugriff:
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In: IEEE Transactions on Plasma Science, Jg. 44 (2016-05-01), Heft 5, S. 808-815Online academicJournalZugriff:
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In: 50th Annual Device Research Conference, 1992, S. 1-1KonferenzZugriff:
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In: Journal of Microelectromechanical Systems, Jg. 32 (2023-06-01), Heft 3, S. 279-289Online academicJournalZugriff:
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In: 2017 Joint IEEE International Symposium on the Applications of Ferroelectric (ISAF)/International Workshop on Acoustic Transduction Materials and Devices (IWATMD)/Piezoresponse Force Microscopy (PFM), 2017-05-01, S. 33-36KonferenzZugriff:
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In: 2016 Joint IEEE International Symposium on the Applications of Ferroelectrics, European Conference on Application of Polar Dielectrics, and Piezoelectric Force Microscopy Workshop (ISAF/ECAPD/PFM), 2016-08-01, S. 1-4KonferenzZugriff:
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In: 2011 12th International Conference on Electronic Packaging Technology and High Density, 2011-08-01, S. 1-4KonferenzZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 3 (2013-04-01), Heft 4, S. 688-695Online academicJournalZugriff:
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In: Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285), 2002, S. 479-482KonferenzZugriff:
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In: 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443), Jg. 1 (2001), S. 692-695KonferenzZugriff:
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In: ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics, Jg. 1 (1996), S. 341-344KonferenzZugriff:
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In: 2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics, 2007-05-01, S. 186KonferenzZugriff:
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In: 2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics, 2007-05-01, S. 717KonferenzZugriff:
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In: IEEE Transactions on Applied Superconductivity, Jg. 9 (1999-06-01), Heft 2, S. 3640-3643Online academicJournalZugriff:
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In: 2019 IEEE International Ultrasonics Symposium (IUS), 2019-10-01, S. 84-87KonferenzZugriff:
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In: International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224), 2001, S. 1KonferenzZugriff:
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In: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011-05-01, S. 1987-1991KonferenzZugriff:
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In: IEEE Electron Device Letters, Jg. PP, Heft 99, S. 1-1academicJournalZugriff: