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Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- components, circuits, devices and systems 195 Treffer
- communication, networking and broadcast technologies 113 Treffer
- engineered materials, dielectrics and plasmas 112 Treffer
- computing and processing 107 Treffer
- signal processing and analysis 89 Treffer
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45 weitere Werte:
- power, energy and industry applications 78 Treffer
- robotics and control systems 58 Treffer
- fields, waves and electromagnetics 55 Treffer
- photonics and electrooptics 54 Treffer
- bonding 45 Treffer
- general topics for engineers 45 Treffer
- engineering profession 34 Treffer
- packaging 32 Treffer
- transportation 31 Treffer
- friction 28 Treffer
- substrates 28 Treffer
- temperature 24 Treffer
- assembly 22 Treffer
- costs 22 Treffer
- bioengineering 21 Treffer
- testing 20 Treffer
- reliability 19 Treffer
- contact resistance 18 Treffer
- geoscience 18 Treffer
- aerospace 17 Treffer
- anisotropic magnetoresistance 15 Treffer
- gold 15 Treffer
- anisotropic conductive films 14 Treffer
- encoding 14 Treffer
- flip chip 14 Treffer
- copper 13 Treffer
- electronics packaging 13 Treffer
- liquid crystal displays 13 Treffer
- resins 13 Treffer
- cof 12 Treffer
- glass 12 Treffer
- integrated circuit interconnections 12 Treffer
- nuclear engineering 11 Treffer
- conductive adhesives 10 Treffer
- curing 10 Treffer
- insulation 10 Treffer
- metals 10 Treffer
- polyimides 10 Treffer
- polymers 10 Treffer
- resistance 10 Treffer
- rough surfaces 10 Treffer
- silicon 10 Treffer
- surface roughness 10 Treffer
- temperature measurement 10 Treffer
- bonding processes 9 Treffer
Verlag
Publikation
- ieee transactions on components, packaging and manufacturing technology, components, packaging and manufacturing technology, ieee transactions on, ieee trans. compon., packag. manufact. technol. 11 Treffer
- ieee transactions on advanced packaging, advanced packaging, ieee transactions on, ieee trans. adv. packag. 7 Treffer
- ieee access, access, ieee 5 Treffer
- ieee sensors journal, sensors journal, ieee, ieee sensors j. 5 Treffer
- 2009 59th electronic components and technology conference, electronic components and technology conference, 2009. ectc 2009. 59th 4 Treffer
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45 weitere Werte:
- fifth international conference onelectronic packaging technology proceedings, 2003. icept2003., electronic packaging technology proceedings, 2003. icept 2003. fifth international conference on, electronic packaging technology 4 Treffer
- ieee photonics journal, photonics journal, ieee, ieee photonics j. 4 Treffer
- ieee transactions on geoscience and remote sensing, geoscience and remote sensing, ieee transactions on, ieee trans. geosci. remote sensing 4 Treffer
- ieee transactions on semiconductor manufacturing, semiconductor manufacturing, ieee transactions on, ieee trans. semicond. manufact. 4 Treffer
- 2009 4th international microsystems, packaging, assembly and circuits technology conference, microsystems, packaging, assembly and circuits technology conference, 2009. impact 2009. 4th international 3 Treffer
- 2011 6th international microsystems, packaging, assembly and circuits technology conference (impact), microsystems, packaging, assembly and circuits technology conference (impact), 2011 6th international 3 Treffer
- 2019 ieee 10th international conference on mechanical and intelligent manufacturing technologies (icmimt), mechanical and intelligent manufacturing technologies (icmimt), 2019 ieee 10th international conference on 3 Treffer
- ieee transactions on industry applications, industry applications, ieee transactions on, ieee trans. on ind. applicat. 3 Treffer
- ieee transactions on information theory, information theory, ieee transactions on, ieee trans. inform. theory 3 Treffer
- ieee transactions on instrumentation and measurement, instrumentation and measurement, ieee transactions on, ieee trans. instrum. meas. 3 Treffer
- ieee transactions on magnetics, magnetics, ieee transactions on, ieee trans. magn. 3 Treffer
- ieee transactions on microwave theory and techniques, microwave theory and techniques, ieee transactions on, ieee trans. microwave theory techn. 3 Treffer
- 1987 american control conference, american control conference, 1987 2 Treffer
- 2005 6th international conference on electronic packaging technology, electronic packaging technology, 2005 6th international conference on, electronics packaging technology 2 Treffer
- 2007 8th international conference on electronic packaging technology, electronic packaging technology, 2007. icept 2007. 8th international conference on 2 Treffer
- 2008 58th electronic components and technology conference, electronic components and technology conference, 2008. ectc 2008. 58th 2 Treffer
- 2008 international conference on electronic materials and packaging, electronic materials and packaging, 2008. emap 2008. international conference on 2 Treffer
- 2010 ieee 17th international conference on industrial engineering and engineering management, industrial engineering and engineering management (ie&em), 2010 ieee 17th international conference on 2 Treffer
- 2012 14th international conference on electronic materials and packaging (emap), electronic materials and packaging (emap), 2012 14th international conference on 2 Treffer
- 2015 ieee 65th electronic components and technology conference (ectc), electronic components and technology conference (ectc) , 2015 ieee 65th 2 Treffer
- 2015 ieee international conference on industrial engineering and engineering management (ieem), industrial engineering and engineering management (ieem), 2015 ieee international conference on 2 Treffer
- ieee robotics and automation letters, robotics and automation letters, ieee, ieee robot. autom. lett. 2 Treffer
- ieee transactions on device and materials reliability, device and materials reliability, ieee transactions on, ieee trans. device mater. relib. 2 Treffer
- ieee transactions on plasma science, plasma science, ieee transactions on, ieee trans. plasma sci. 2 Treffer
- journal of lightwave technology, lightwave technology, journal of, j. lightwave technol. 2 Treffer
- proceedings of 2004 international conference on the business of electronic product reliability and liability (ieee cat. no.04ex809), business of electronic product reliability and liability, 2004 international conference on, business of electronic product reliability and liability 2 Treffer
- proceedings of the 4th international symposium on electronic materials and packaging, 2002., electronic materials and packaging, 2002. proceedings of the 4th international symposium on, electronic materials and packaging 2 Treffer
- proceedings of the sixth ieee cpmt conference on high density microsystem design and packaging and component failure analysis (hdp '04), high density microsystem design and packaging and component failure analysis, 2004. hdp '04. proceeding of the sixth ieee cpmt conference on, high density microsystem design and packaging and component failure analysis 2 Treffer
- proceedings. 1998 international conference on multichip modules and high density packaging (cat. no.98ex154), multichip modules and high density packaging, 1998. proceedings. 1998 international conference on, multichip modules and high density packaging 2 Treffer
- [1988] proceedings. the twentieth southeastern symposium on system theory, system theory, 1988., proceedings of the twentieth southeastern symposium on 1 Treffer
- 14th international conference on microwaves, radar and wireless communications. mikon - 2002. conference proceedings (ieee cat.no.02ex562), microwaves, radar and wireless communications, 2002. mikon-2002. 14th international conference on, microwaves, radar and wireless communicatons 1 Treffer
- 1989 american control conference, american control conference, 1989 1 Treffer
- 1996 ieee mtt-s international microwave symposium digest, microwave symposium digest, 1996., ieee mtt-s international, microwave symposium 1 Treffer
- 1997 proceedings 47th electronic components and technology conference, electronic components and technology conference, 1997. proceedings., 47th, electronic components and technology 1 Treffer
- 1998 ieee 5th international symposium on spread spectrum techniques and applications - proceedings. spread technology to africa (cat. no.98th8333), spread spectrum techniques and applications, 1998. proceedings., 1998 ieee 5th international symposium on, spread spectrum techniques and applications 1 Treffer
- 1999 ieee leos annual meeting conference proceedings. leos'99. 12th annual meeting. ieee lasers and electro-optics society 1999 annual meeting (cat. no.99ch37009), leos '99. ieee lasers and electro-optics society 1999 12th annual meeting, leos'99 1 Treffer
- 2000 ieee sixth international symposium on spread spectrum techniques and applications. issta 2000. proceedings (cat. no.00th8536), spread spectrum techniques and applications, 2000 ieee sixth international symposium on, spread spectrum techniques and applications 1 Treffer
- 2004 24th international conference on microelectronics (ieee cat. no.04th8716), microelectronics, 2004. 24th international conference on, microelectronics 1 Treffer
- 2004 international ieee conference on the asian green electronics (agec). proceedings of, asian green electronics, 2004. agec. proceedings of 2004 international ieee conference on the, asian green electronics 1 Treffer
- 2006 7th international conference on electronic packaging technology, electronic packaging technology, 2006. icept '06. 7th international conference on 1 Treffer
- 2006 8th electronics packaging technology conference, electronics packaging technology conference, 2006. eptc '06. 8th 1 Treffer
- 2006 ieee ninth international symposium on spread spectrum techniques and applications, spread spectrum techniques and applications, 2006 ieee ninth international symposium on 1 Treffer
- 2006 international conference of the ieee engineering in medicine and biology society, engineering in medicine and biology society, 2006. embs '06. 28th annual international conference of the ieee 1 Treffer
- 2006 international symposium on communications and information technologies, communications and information technologies, 2006. iscit '06. international symposium on 1 Treffer
- 2006 optical fiber communication conference and the national fiber optic engineers conference, optical fiber communication conference, 2006 and the 2006 national fiber optic engineers conference. ofc 2006, optical fiber communication 1 Treffer
320 Treffer
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In: 2024 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON), 2024-01-31, S. 336-341KonferenzZugriff:
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In: 2023 Advances in Science and Engineering Technology International Conferences (ASET), 2023-02-20, S. 1-5KonferenzZugriff:
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In: IEEE Sensors Journal, Jg. 23 (2023-05-01), Heft 9, S. 9271-9279Online academicJournalZugriff:
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In: 2023 China Semiconductor Technology International Conference (CSTIC), 2023-06-26, S. 1-3KonferenzZugriff:
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In: IEEE Transactions on Geoscience and Remote Sensing, Jg. 61 (2023), S. 1-17Online academicJournalZugriff:
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In: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018-12-01, S. 924-931KonferenzZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 12 (2022-06-01), Heft 6, S. 916-920Online academicJournalZugriff:
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In: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019-05-01, S. 283-288KonferenzZugriff:
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In: 2024 6th International Conference on Electrical Engineering and Information & Communication Technology (ICEEICT), 2024-05-02, S. 899-903KonferenzZugriff:
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In: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011-10-01, S. 191-194KonferenzZugriff:
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In: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011-10-01, S. 273-275KonferenzZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 1 (2011), Heft 1, S. 33-42Online academicJournalZugriff:
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In: 2015 IEEE 23rd International Conference on Network Protocols (ICNP), 2015-11-01, S. 32-42KonferenzZugriff:
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Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding ProcessIn: IEEE Transactions on Advanced Packaging, Jg. 32 (2009-08-01), Heft 3, S. 593-601Online academicJournalZugriff:
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In: IEEE Transactions on Electronics Packaging Manufacturing, Jg. 31 (2008-10-01), Heft 4, S. 285-290Online academicJournalZugriff:
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In: 2015 IEEE International Reliability Physics Symposium, 2015-04-01, S. 1KonferenzZugriff:
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In: IEEE Sensors Journal, Jg. 23 (2023-12-01), Heft 23, S. 29761-29773Online academicJournalZugriff:
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In: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011-10-01, S. 276-279KonferenzZugriff:
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In: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010-06-01, S. 1125-1131KonferenzZugriff:
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In: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011-05-01, S. 656-660KonferenzZugriff: