Suchergebnisse
UB Katalog
Artikel & mehr
Suchmaske
Suchergebnisse einschränken oder erweitern
Aktive Suchfilter
Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- exact sciences and technology 933 Treffer
- sciences exactes et technologie 933 Treffer
- applied sciences 865 Treffer
- sciences appliquees 865 Treffer
- electronics 801 Treffer
-
45 weitere Werte:
- electronique 801 Treffer
- assemblage brasage tendre 656 Treffer
- technologie bga 655 Treffer
- bga technology 628 Treffer
- junta soldada 623 Treffer
- soldered joint 623 Treffer
- electronique des semiconducteurs. microelectronique. optoelectronique. dispositifs a l'etat solide 622 Treffer
- semiconductor electronics. microelectronics. optoelectronics. solid state devices 622 Treffer
- tecnologia bga 608 Treffer
- electronic packaging 598 Treffer
- packaging electronico 596 Treffer
- packaging electronique 596 Treffer
- integrated circuits 522 Treffer
- circuits integres 521 Treffer
- conception. technologies. analyse fonctionnement. essais 516 Treffer
- design. technologies. operation analysis. testing 516 Treffer
- assemblage circuit integre 470 Treffer
- integrated circuit bonding 470 Treffer
- reliability 378 Treffer
- fiabilite 372 Treffer
- fiabilidad 362 Treffer
- physics 291 Treffer
- physique 291 Treffer
- appareillage electronique et fabrication. composants passifs, circuits imprimes, connectique 283 Treffer
- electronic equipment and fabrication. passive components, printed wiring boards, connectics 283 Treffer
- circuit integre 233 Treffer
- integrated circuit 233 Treffer
- circuito integrado 232 Treffer
- biological and medical sciences 208 Treffer
- sciences biologiques et medicales 208 Treffer
- interconnexion 203 Treffer
- interconexion 202 Treffer
- interconnection 202 Treffer
- telecommunications 175 Treffer
- essais, mesure, bruit et fiabilite 167 Treffer
- testing, measurement, noise and reliability 167 Treffer
- condensed state physics 161 Treffer
- physique de l'etat condense 161 Treffer
- evaluacion prestacion 160 Treffer
- evaluation performance 160 Treffer
- optics 160 Treffer
- optique 160 Treffer
- performance evaluation 160 Treffer
- fabrication microelectronique (technologie des materiaux et des surfaces) 155 Treffer
- microelectronic fabrication (materials and surfaces technology) 155 Treffer
Verlag
- institute of electrical and electronics engineers 210 Treffer
- elsevier 187 Treffer
- ieee 126 Treffer
- spie 115 Treffer
- springer 95 Treffer
-
45 weitere Werte:
- imaps 34 Treffer
- elsevier science 31 Treffer
- emerald 30 Treffer
- mcb university press 22 Treffer
- international microelectronics and packaging society imaps 17 Treffer
- international microelectronics and packaging society 13 Treffer
- schulz 11 Treffer
- taylor & francis 11 Treffer
- institute of physics 10 Treffer
- nec creative 9 Treffer
- wiley 9 Treffer
- oxford university press 8 Treffer
- blackwell 7 Treffer
- japan institute of metals 7 Treffer
- american society for microbiology 6 Treffer
- schaper 6 Treffer
- deutsche fachverlag 5 Treffer
- hanser 5 Treffer
- japan society of mechanical engineers 4 Treffer
- university of chicago press 4 Treffer
- urban & fischer 4 Treffer
- american chemical society 3 Treffer
- biotech 3 Treffer
- blackwell publishing 3 Treffer
- blackwell science 3 Treffer
- electrochemical society 3 Treffer
- ieee computer society 3 Treffer
- indian society of soil science, division of soil science and agricultural chemistry 3 Treffer
- institution of electrical engineers 3 Treffer
- laboratoire tima 3 Treffer
- thieme 3 Treffer
- [tima] 2 Treffer
- american society of plant physiologists 2 Treffer
- cambridge university press 2 Treffer
- cantor 2 Treffer
- de gruyter 2 Treffer
- gestion location intervention 2 Treffer
- institution of engineering and technology 2 Treffer
- international association for food protection 2 Treffer
- international association of milk, food and environmental sanitarians 2 Treffer
- karger 2 Treffer
- mechanical engineering publications 2 Treffer
- penton media 2 Treffer
- selper 2 Treffer
- [s.n.] 1 Treffer
Publikation
- spie proceedings series 139 Treffer
- microelectronics and reliability 93 Treffer
- journal of electronic materials 81 Treffer
- ieee transactions on advanced packaging 68 Treffer
- proceedings - electronic components conference 62 Treffer
-
45 weitere Werte:
- 54th electronic components & technology conference (las vegas nv, 1-4 june 2004) 35 Treffer
- ieee transactions on components, packaging, and manufacturing technology (2011. print) 30 Treffer
- soldering & surface mount technology 30 Treffer
- 52nd electronic components & technology conference (san diego ca, 28-31 may 2002) 27 Treffer
- journal of alloys and compounds 25 Treffer
- ieee transactions on electronics packaging manufacturing 24 Treffer
- imaps 2000 : international symposium on microelectronics (boston ma, 20-22 september 2000) 24 Treffer
- microelectronics international 22 Treffer
- imaps : international symposium on microelectronics (denver co, 4-6 september 2002) 21 Treffer
- itherm 2004 (ninth intersociety conference on thermal and thermomechanical phenomena in electronic systems) 20 Treffer
- microelectronics (baltimore md, 9-11 october 2001) 18 Treffer
- journal of materials science. materials in electronics 17 Treffer
- the international journal of microcircuits and electronic packaging 17 Treffer
- international symposium on microelectronics (san diego ca, 1-4 november 1998) 16 Treffer
- ieee/cpmt international electronics manufacturing technology symposium 15 Treffer
- iemt 2002 : international electronics manufacturing technology symposium (san jose ca, 17-18 july 2002) 15 Treffer
- journal of microelectronics and electronic packaging 13 Treffer
- microelectronic engineering 13 Treffer
- aids - forschung 11 Treffer
- imaps : international symposium on microelectronics (chicago il, 26-28 october 1999) 11 Treffer
- high-density interconnect and systems packaging (denver co, 25-28 april 2000) 10 Treffer
- 29th international electronics manufacturing technology symposium (san jose ca ca, 14-16 july 2004) 9 Treffer
- international conference on high density packaging and mcms (denver co, 6-9 april 1999) 9 Treffer
- microsystem technologies 9 Treffer
- nec research & development 9 Treffer
- materials transactions - jim 7 Treffer
- archiv fur lebensmittelhygiene 6 Treffer
- materials science & engineering. a, structural materials : properties, microstructure and processing 6 Treffer
- microelectronics journal 6 Treffer
- pb-free solders and materials for emerging interconnect and packaging technologies 6 Treffer
- 2002 international conference on advanced packaging and systems (reno nv, 10-13 march 2002) 5 Treffer
- f & m. feinwerktechnik, mikrotechnik, messtechnik 5 Treffer
- fleischwirtschaft (frankfurt) 5 Treffer
- high-density interconnect and systems packaging (santa clara ca, 17-20 april 2001) 5 Treffer
- ieee transactions on microwave theory and techniques 5 Treffer
- brain research 4 Treffer
- electronics components and technology conference 4 Treffer
- ieee journal of solid-state circuits 4 Treffer
- ieee microwave and wireless components letters 4 Treffer
- journal of food protection 4 Treffer
- jsme international journal. series a, solid mechanics and material engineering 4 Treffer
- lecture notes in computer science 4 Treffer
- microelectronics (boston ma, 18-20 november 2003) 4 Treffer
- mycorrhiza (berlin) 4 Treffer
- proceedings of spie, the international society for optical engineering 4 Treffer
Sprache
Geographischer Bezug
1.135 Treffer
-
In: Microelectronics and reliability, Jg. 54 (2014), Heft 1, S. 226-232academicJournalZugriff:
-
In: IEEE transactions on electronics packaging manufacturing, Jg. 28 (2005), Heft 4, S. 328-337Online KonferenzZugriff:
-
In: Proceedings of the ninth european workshop on materials for advanced metallization 2005, 6-9 March 2005, Dresden, Germany, Jg. 82 (2005), Heft 3-4, S. 569-574KonferenzZugriff:
-
In: 16th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2005), Arcachon, France, October 10-14, Jg. 45 (2005), Heft 9-11, S. 1652-1657KonferenzZugriff:
-
In: Microelectronics and reliability, Jg. 47 (2007), Heft 2-3, S. 205-214KonferenzZugriff:
-
In: 2004 4th IEEE international conference on polymers and adhesives in microelectronics and photonics (Portland OR, 12-15 September 2004), 2004, S. 163-170KonferenzZugriff:
-
In: 9th international symposium on advanced packaging materials (processes, properties and interfaces), 2004, S. 38-44KonferenzZugriff:
-
In: 29th international electronics manufacturing technology symposium (San Jose CA CA, 14-16 July 2004), 2004, S. 345-354KonferenzZugriff:
-
In: 9th international symposium on advanced packaging materials (processes, properties and interfaces), 2004, S. 31-37KonferenzZugriff:
-
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packagesIn: Eurosime special section package and solder joint reliability analysed by fem simulation and experiments, Jg. 44 (2004), Heft 12, S. 1957-1965KonferenzZugriff:
-
In: Journal of electronic materials, Jg. 43 (2014), Heft 9, S. 3341-3350Online academicJournalZugriff:
-
In: Journal of electronic materials, Jg. 43 (2014), Heft 11, S. 4229-4240Online academicJournalZugriff:
-
In: Proceedings of the 13th International Conference on Surface Modification of Materials by Ion Beams, Jg. 196 (2005), Heft 1-3, S. 192-197KonferenzZugriff:
-
In: Proceedings of the ninth european workshop on materials for advanced metallization 2005, 6-9 March 2005, Dresden, Germany, Jg. 82 (2005), Heft 3-4, S. 561-568KonferenzZugriff:
-
In: IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002), 2002, S. 691-696KonferenzZugriff:
-
In: IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002), 2002, S. 524-532KonferenzZugriff:
-
In: 52nd electronic components & technology conference (San Diego CA, 28-31 May 2002), 2002, S. 1291-1296KonferenzZugriff:
-
In: 52nd electronic components & technology conference (San Diego CA, 28-31 May 2002), 2002, S. 1114-1118KonferenzZugriff:
-
In: IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002), 2002, S. 10-15KonferenzZugriff:
-
In: 52nd electronic components & technology conference (San Diego CA, 28-31 May 2002), 2002, S. 1753-1756KonferenzZugriff: