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Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding ProcessIn: IEEE transactions on advanced packaging, Jg. 32 (2009), Heft 3, S. 593-601Online academicJournalZugriff:
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In: IEEE Transactions on Advanced Packaging, Jg. 32 (2009-08-01), Heft 3, S. 593-601Online academicJournalZugriff:
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Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding ProcessIn: IEEE Transactions on Advanced Packaging, Jg. 32 (2009-08-01), S. 593-601Online unknownZugriff: