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In: IFIP Advances in Information and Communication Technology ; 8th Doctoral Conference on Computing, Electrical and Industrial Systems (DoCEIS) ; https://hal.inria.fr/hal-01629561 ; 8th Doctoral Conference on Computing, 2017Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 8th Doctoral Conference on Computing, Electrical and Industrial Systems (DoCEIS) ; https://hal.inria.fr/hal-01629561 ; 8th Doctoral Conference on Computing, 2017Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 11th Doctoral Conference on Computing, Electrical and Industrial Systems (DoCEIS) ; https://hal.inria.fr/hal-03741562 ; 11th Doctoral Conference on Computing, 2020Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-02321770 ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2018, Verona, Italy. pp.1-13, ⟨10.1007/978-3-030-23425-6_1⟩, 2018Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-02321770 ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2018, Verona, Italy. pp.1-13, ⟨10.1007/978-3-030-23425-6_1⟩, 2018Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-02319796 ; 25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2017, Abu Dhabi, United Arab Emirates. pp.22-45, ⟨10.1007/978-3-030-15663-3_2⟩, 2017Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-02319796 ; 25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2017, Abu Dhabi, United Arab Emirates. pp.22-45, ⟨10.1007/978-3-030-15663-3_2⟩, 2017Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC) ; https://hal.inria.fr/hal-01675195 ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC), Sep 2016, Tallinn, Estonia. pp.60-82, ⟨10.1007/978-3-319-67104-8_4⟩, 2016Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC) ; https://hal.inria.fr/hal-01675201 ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC), Sep 2016, Tallinn, Estonia. pp.1-23, ⟨10.1007/978-3-319-67104-8_1⟩, 2016Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC) ; https://hal.inria.fr/hal-01675195 ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC), Sep 2016, Tallinn, Estonia. pp.60-82, ⟨10.1007/978-3-319-67104-8_4⟩, 2016Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC) ; https://hal.inria.fr/hal-01675201 ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC), Sep 2016, Tallinn, Estonia. pp.1-23, ⟨10.1007/978-3-319-67104-8_1⟩, 2016Online KonferenzZugriff:
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In: Spintronics-based Computing ; https://hal.science/hal-01976635 ; Weisheng Zhao; Guillaume Prenat. Spintronics-based Computing, Springer International Publishing, pp.145-157, 2015, 978-3-319-34661-8. ⟨10.1007/978-3-319-15180-9_4⟩ ; https://link.springer.com/book/10.1007/978-3-319-15180-9; (2015)Online BuchZugriff:
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In: Spintronics-based Computing ; https://hal.science/hal-01976635 ; Weisheng Zhao; Guillaume Prenat. Spintronics-based Computing, Springer International Publishing, pp.145-157, 2015, 978-3-319-34661-8. ⟨10.1007/978-3-319-15180-9_4⟩ ; https://link.springer.com/book/10.1007/978-3-319-15180-9; (2015)Online BuchZugriff:
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In: Spintronics-based Computing ; https://hal.archives-ouvertes.fr/hal-01976635 ; Weisheng Zhao; Guillaume Prenat. Spintronics-based Computing, Springer International Publishing, pp.145-157, 2015, 978-3-319-34661-8. ⟨10.1007/978-3-319-15180-9_4⟩ ; https://link.springer.com/book/10.1007/978-3-319-15180-9; (2015)Online BuchZugriff:
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In: IFIP Advances in Information and Communication Technology ; 28th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-03759730 ; 28th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2020, Salt Lake City, UT, United States. pp.65-85, ⟨10.1007/978-3-030-81641-4_4⟩, 2020Online KonferenzZugriff:
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In: IFIP Advances in Information and Communication Technology ; 28th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-03759730 ; 28th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2020, Salt Lake City, UT, United States. pp.65-85, ⟨10.1007/978-3-030-81641-4_4⟩, 2020Online KonferenzZugriff:
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In: Advances on Mechanics, Design Engineering and Manufacturing IV ; https://hal.science/hal-03810527 ; Advances on Mechanics, Design Engineering and Manufacturing IV, Springer International Publishing; Springer International Publishing, pp.803-814, 2022, Lecture Notes in Mechanical Engineering, ⟨10.1007/978-3-031-15928-2_70⟩; (2022)Online BuchZugriff:
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In: Advances on Mechanics, Design Engineering and Manufacturing IV ; https://hal.science/hal-03810527 ; Advances on Mechanics, Design Engineering and Manufacturing IV, Springer International Publishing; Springer International Publishing, pp.803-814, 2022, Lecture Notes in Mechanical Engineering, ⟨10.1007/978-3-031-15928-2_70⟩; (2022)Online BuchZugriff:
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In: Advances on Mechanics, Design Engineering and Manufacturing IV ; https://hal.science/hal-03810527 ; Advances on Mechanics, Design Engineering and Manufacturing IV, Springer International Publishing; Springer International Publishing, pp.803-814, 2022, Lecture Notes in Mechanical Engineering, ⟨10.1007/978-3-031-15928-2_70⟩; (2022)Online BuchZugriff:
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In: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics ; https://hal.science/hal-02443369 ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, Jun 2019, Reno, United States. ⟨10.1007/978-3-030-30098-2_7⟩, 2019Online KonferenzZugriff: