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Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- components, circuits, devices and systems 9 Treffer
- engineered materials, dielectrics and plasmas 6 Treffer
- computing and processing 4 Treffer
- laminates 4 Treffer
- adhesives 3 Treffer
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45 weitere Werte:
- general topics for engineers 3 Treffer
- geometry 3 Treffer
- strain 3 Treffer
- composite materials 2 Treffer
- copper 2 Treffer
- electric potential 2 Treffer
- electric resistance 2 Treffer
- electrical resistance measurement 2 Treffer
- electromagnetic compatibility 2 Treffer
- loading 2 Treffer
- materials 2 Treffer
- multichip modules 2 Treffer
- silicon 2 Treffer
- stress 2 Treffer
- testing 2 Treffer
- adhesion strength 1 Treffer
- aging 1 Treffer
- atmosphere 1 Treffer
- automotive engineering 1 Treffer
- bridge circuits 1 Treffer
- capacitive sensors 1 Treffer
- communication, networking and broadcast technologies 1 Treffer
- degradation 1 Treffer
- elasticity 1 Treffer
- electrodes 1 Treffer
- emc 1 Treffer
- encapsulation 1 Treffer
- energy release rate 1 Treffer
- engineering profession 1 Treffer
- fatigue 1 Treffer
- films 1 Treffer
- finite element methods 1 Treffer
- force 1 Treffer
- furnaces 1 Treffer
- history 1 Treffer
- interface 1 Treffer
- lead compounds 1 Treffer
- life estimation 1 Treffer
- load modeling 1 Treffer
- materials science and technology 1 Treffer
- mechanical engineering 1 Treffer
- mechanical factors 1 Treffer
- microelectronics 1 Treffer
- nonhomogeneous media 1 Treffer
- nonlinear equations 1 Treffer
Publikation
- 5th korea-russia international symposium on science and technology. proceedings. korus 2001 (cat. no.01ex478), science and technology, 2001. korus '01. proceedings. the fifth russian-korean international symposium on, korea-russia international symposium on science and technology 2 Treffer
- 1998 5th international conference on solid-state and integrated circuit technology. proceedings (cat. no.98ex105), solid-state and integrated circuit technology, 1998. proceedings. 1998 5th international conference on, solid-state and integrated circuit technology 1 Treffer
- 2007 international conference on thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems. eurosime 2007, thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems, 2007. eurosime 2007. international conference on 1 Treffer
- 2008 10th electronics packaging technology conference, electronics packaging technology conference, 2008. eptc 2008. 10th 1 Treffer
- 2008 international conference on electronic packaging technology & high density packaging, electronic packaging technology & high density packaging, 2008. icept-hdp 2008. international conference on 1 Treffer
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5 weitere Werte:
- 2010 5th international microsystems packaging assembly and circuits technology conference, microsystems packaging assembly and circuits technology conference (impact), 2010 5th international 1 Treffer
- 2011 ieee international interconnect technology conference, interconnect technology conference and 2011 materials for advanced metallization (iitc/mam), 2011 ieee international 1 Treffer
- 2016 ieee 66th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2016 ieee 66th 1 Treffer
- 2018 ieee 20th electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2018 ieee 20th 1 Treffer
- proceedings of the 5th electronics system-integration technology conference (estc), electronics system-integration technology conference (estc), 2014 1 Treffer
11 Treffer
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In: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018-12-01, S. 26-30KonferenzZugriff:
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In: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010-10-01, S. 1-4KonferenzZugriff:
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In: 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime, 2007-04-01, S. 1KonferenzZugriff:
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In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016-05-01, S. 1054-1060KonferenzZugriff:
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In: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 2014-09-01, S. 1-7KonferenzZugriff:
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In: 2011 IEEE International Interconnect Technology Conference, 2011-05-01, S. 1-3KonferenzZugriff:
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In: 1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105), 1998, S. 564-567KonferenzZugriff:
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In: 5th Korea-Russia International Symposium on Science and Technology. Proceedings. KORUS 2001 (Cat. No.01EX478), Jg. 1 (2001), S. 240-242KonferenzZugriff:
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In: 5th Korea-Russia International Symposium on Science and Technology. Proceedings. KORUS 2001 (Cat. No.01EX478), Jg. 3 (2001), S. 15-17KonferenzZugriff:
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In: 2008 10th Electronics Packaging Technology Conference, 2008-12-01, S. 808KonferenzZugriff:
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In: 2008 International Conference on Electronic Packaging Technology & High Density, 2008-07-01, S. 1KonferenzZugriff: