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Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- components, circuits, devices and systems 284 Treffer
- business 167 Treffer
- business.industry 164 Treffer
- engineered materials, dielectrics and plasmas 151 Treffer
- computing and processing 137 Treffer
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45 weitere Werte:
- light emitting diodes 132 Treffer
- materials science 113 Treffer
- communication, networking and broadcast technologies 103 Treffer
- signal processing and analysis 94 Treffer
- law 83 Treffer
- law.invention 82 Treffer
- chip 74 Treffer
- power, energy and industry applications 74 Treffer
- photonics and electrooptics 71 Treffer
- computer science 64 Treffer
- fields, waves and electromagnetics 62 Treffer
- engineering 61 Treffer
- packaging 59 Treffer
- substrates 58 Treffer
- electronic engineering 49 Treffer
- temperature measurement 49 Treffer
- light-emitting diode 45 Treffer
- optoelectronics 44 Treffer
- robotics and control systems 44 Treffer
- electrical engineering 43 Treffer
- general topics for engineers 43 Treffer
- thermal resistance 41 Treffer
- capacitance 39 Treffer
- capacitors 38 Treffer
- electronic packaging 38 Treffer
- chemistry 37 Treffer
- flip chip 36 Treffer
- temperature 36 Treffer
- hardware_integratedcircuits 35 Treffer
- assembly 34 Treffer
- composite material 34 Treffer
- integrated circuit packaging 34 Treffer
- random access memory 34 Treffer
- bonding 33 Treffer
- costs 33 Treffer
- lighting 33 Treffer
- 02 engineering and technology 32 Treffer
- bioengineering 30 Treffer
- phosphors 29 Treffer
- silicon 29 Treffer
- engineering profession 27 Treffer
- aerospace 26 Treffer
- electronic packaging thermal management 25 Treffer
- electronics 25 Treffer
- electronics packaging 25 Treffer
Verlag
- hal ccsd 7 Treffer
- austrian center for medical innovation and technology, wiener neustadt, austria 1 Treffer
- brno university of technology, czech republic 1 Treffer
- business center for academic societies 1 Treffer
- cardiff university, cardiff, uk 1 Treffer
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6 weitere Werte:
- fraunhofer institute for manufacturing engineering and automation (ipa), germany 1 Treffer
- fraunhofer institute for manufacturing engineering and automation, germany 1 Treffer
- fundacion instituto gerontologico matia - ingema, spain 1 Treffer
- shanghai university 1 Treffer
- stuttgart media university, germany 1 Treffer
- university of bedfordshire, uk 1 Treffer
Publikation
- ieee transactions on electron devices 28 Treffer
- ieee transactions on components, packaging & manufacturing technology 15 Treffer
- ieee transactions on magnetics 12 Treffer
- ieee transactions on semiconductor manufacturing 12 Treffer
- 2014 15th international conference on electronic packaging technology 9 Treffer
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45 weitere Werte:
- electronic components and technology conference 8 Treffer
- ieee access 8 Treffer
- ieee transactions on advanced packaging 8 Treffer
- ieee transactions on circuits & systems. part i: regular papers 8 Treffer
- ieee transactions on electron devices, electron devices, ieee transactions on, ieee trans. electron devices 8 Treffer
- ieee transactions on magnetics, magnetics, ieee transactions on, ieee trans. magn. 8 Treffer
- ieee transactions on microwave theory & techniques 8 Treffer
- ieee transactions on geoscience & remote sensing 7 Treffer
- 2013 10th china international forum on solid state lighting (chinassl) 6 Treffer
- ieee electron device letters 6 Treffer
- ieee transactions on electronics packaging manufacturing 6 Treffer
- 12th international electronic manufacturing technology symposium 5 Treffer
- 1992 proceedings 42nd electronic components & technology conference 4 Treffer
- 2011 12th international conference on electronic packaging technology and high density packaging 4 Treffer
- 2012 13th international conference on electronic packaging technology & high density packaging 4 Treffer
- 2012 ieee international conference on communications (icc) 4 Treffer
- 52nd electronic components & technology conference (san diego ca, 28-31 may 2002) 4 Treffer
- digest of intermag 2003. international magnetics conference (cat. no.03ch37401) 4 Treffer
- ieee transactions on biomedical engineering 4 Treffer
- ieee transactions on components & packaging technologies 4 Treffer
- ieee transactions on computer-aided design of integrated circuits & systems 4 Treffer
- ieee transactions on industrial electronics 4 Treffer
- ieee transactions on pattern analysis & machine intelligence 4 Treffer
- proceedings - electronic components conference 4 Treffer
- 1997 proceedings 47th electronic components and technology conference 3 Treffer
- 2006 7th international conference on electronic packaging technology 3 Treffer
- 2006 ieee aerospace conference 3 Treffer
- 2008 international symposium on information technology 3 Treffer
- 2014 joint ieee international symposium on the applications of ferroelectric, international workshop on acoustic transduction materials and devices & workshop on piezoresponse force microscopy 3 Treffer
- 2017 brazilian power electronics conference (cobep 3 Treffer
- ieee transactions on components, packaging & manufacturing technology, part c 3 Treffer
- ieee transactions on computers 3 Treffer
- ieee transactions on power electronics 3 Treffer
- ieee transactions on robotics & automation 3 Treffer
- issn: 0278-0070 ; ieee transactions on computer-aided design of integrated circuits and systems ; https://hal.science/hal-03969267 ; ieee transactions on computer-aided design of integrated circuits and systems, 2022, 41 (11), pp.4965-4974. ⟨10.1109/tcad.2021.3136982⟩ 3 Treffer
- 2013 ieee international symposium on advanced packaging materials 2 Treffer
- 2013 mts/ieee oceans - bergen 2 Treffer
- 2014 2nd international conference on technology, informatics, management, engineering & environment 2 Treffer
- digest of technical papers - symposium on vlsi technology 2 Treffer
- ieee international magnetics conference 2 Treffer
- international magnetics conference 2 Treffer
- international technical digest on electron devices 2 Treffer
- joint napmrc 2003. digest of technical papers 2 Treffer
- oceans conference record (ieee) 2 Treffer
- proceedings of 1994 ieee international reliability physics symposium 2 Treffer
Sprache
1.087 Treffer
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In: TENCON 2022 - 2022 IEEE Region 10 Conference (TENCON), 2022-11-01, S. 1-5KonferenzZugriff:
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In: 2019 IEEE 15th Brazilian Power Electronics Conference and 5th IEEE Southern Power Electronics Conference (COBEP/SPEC), 2019-12-01, S. 1-6KonferenzZugriff:
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In: 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers), 2023-05-01, S. 1-2KonferenzZugriff:
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In: 2020 5th International Conference on Renewable Energies for Developing Countries (REDEC), 2020-06-01, S. 1-5KonferenzZugriff:
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In: 2019 IEEE 15th Brazilian Power Electronics Conference and 5th IEEE Southern Power Electronics Conference (COBEP/SPEC), 2019-12-01, S. 1-6KonferenzZugriff:
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In: IEEE Transactions on Electron Devices, Jg. 67 (2020-09-01), Heft 9, S. 3655-3659Online academicJournalZugriff:
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In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018-08-01, S. 121-124KonferenzZugriff:
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In: 2018 13th IEEE International Conference on Industry Applications (INDUSCON), 2018-11-01, S. 487-494KonferenzZugriff:
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In: 2021 International Conference on Machine Learning and Intelligent Systems Engineering (MLISE), 2021-07-01, S. 357-361KonferenzZugriff:
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In: IEEE Access, Jg. 10 (2022), S. 78848-78859Online academicJournalZugriff:
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In: 2017 Brazilian Power Electronics Conference (COBEP), 2017-11-01, S. 1-6KonferenzZugriff:
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In: 2017 Brazilian Power Electronics Conference (COBEP), 2017-11-01, S. 1-6KonferenzZugriff:
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In: 2017 Brazilian Power Electronics Conference (COBEP), 2017-11-01, S. 1-6KonferenzZugriff:
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In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017-08-01, S. 451-455KonferenzZugriff:
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In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-01, S. 816-819KonferenzZugriff:
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In: IEEE Transactions on Electron Devices, Jg. 64 (2017-10-01), Heft 10, S. 4149-4155Online academicJournalZugriff:
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In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2019-09-01, S. 1-7KonferenzZugriff:
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In: 2020 17th China International Forum on Solid State Lighting & 2020 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS), 2020-11-23, S. 123-126KonferenzZugriff:
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In: 2020 13th International Conference on Advanced Semiconductor Devices And Microsystems (ASDAM), 2020-10-11, S. 27-30KonferenzZugriff:
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In: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016-05-01, S. 199-202KonferenzZugriff: