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Weniger Treffer
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- ag sintering 1 Treffer
- bonding 1 Treffer
- ceramics 1 Treffer
- components, circuits, devices and systems 1 Treffer
- computing and processing 1 Treffer
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16 weitere Werte:
- dbc 1 Treffer
- deformable models 1 Treffer
- electric field strength 1 Treffer
- electric fields 1 Treffer
- electric variables measurement 1 Treffer
- encapsulation 1 Treffer
- insulating substrate 1 Treffer
- layout 1 Treffer
- metallization 1 Treffer
- partial discharge 1 Treffer
- partial discharges 1 Treffer
- strain 1 Treffer
- stress 1 Treffer
- testing 1 Treffer
- thermal analysis 1 Treffer
- thermal stresses 1 Treffer
Publikation
- 2015 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iacc), 2015 international conference on 1 Treffer
- 2016 international conference on electronics packaging (icep), electronics packaging (icep), 2016 international conference on 1 Treffer
2 Treffer
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In: 2016 International Conference on Electronics Packaging (ICEP), 2016-04-01, S. 530-535KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 818-821KonferenzZugriff: