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  1. Madeira, Ricardo ; Paulino, Nuno ; et al.
    In: IFIP Advances in Information and Communication Technology ; 8th Doctoral Conference on Computing, Electrical and Industrial Systems (DoCEIS) ; https://hal.inria.fr/hal-01629561 ; 8th Doctoral Conference on Computing, 2017
    Online Konferenz
  2. Madeira, Ricardo ; Paulino, Nuno ; et al.
    In: IFIP Advances in Information and Communication Technology ; 8th Doctoral Conference on Computing, Electrical and Industrial Systems (DoCEIS) ; https://hal.inria.fr/hal-01629561 ; 8th Doctoral Conference on Computing, 2017
    Online Konferenz
  3. Madeira, Ricardo ; Paulino, Nuno ; et al.
    In: IFIP Advances in Information and Communication Technology ; 11th Doctoral Conference on Computing, Electrical and Industrial Systems (DoCEIS) ; https://hal.inria.fr/hal-03741562 ; 11th Doctoral Conference on Computing, 2020
    Online Konferenz
  4. Ojima, Naoki ; Nakura, Toru ; et al.
    In: IFIP Advances in Information and Communication Technology ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-02321770 ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2018, Verona, Italy. pp.1-13, ⟨10.1007/978-3-030-23425-6_1⟩, 2018
    Online Konferenz
  5. Ojima, Naoki ; Nakura, Toru ; et al.
    In: IFIP Advances in Information and Communication Technology ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-02321770 ; 26th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2018, Verona, Italy. pp.1-13, ⟨10.1007/978-3-030-23425-6_1⟩, 2018
    Online Konferenz
  6. Stanzial, D. ; Buiat, M. ; et al.
    2014
    Online Konferenz
  7. Janeska Stamenkovska, Ivana ; Dimitrievski, Dragi ; et al.
    2021
    academicJournal
  8. Copetti, Thiago ; Medeiros, Guilherme ; et al.
    In: IFIP Advances in Information and Communication Technology ; 25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-02319796 ; 25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2017, Abu Dhabi, United Arab Emirates. pp.22-45, ⟨10.1007/978-3-030-15663-3_2⟩, 2017
    Online Konferenz
  9. Copetti, Thiago ; Medeiros, Guilherme ; et al.
    In: IFIP Advances in Information and Communication Technology ; 25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-02319796 ; 25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2017, Abu Dhabi, United Arab Emirates. pp.22-45, ⟨10.1007/978-3-030-15663-3_2⟩, 2017
    Online Konferenz
  10. Tenace, Valerio ; Calimera, Andrea ; et al.
    In: IFIP Advances in Information and Communication Technology ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC) ; https://hal.inria.fr/hal-01675195 ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC), Sep 2016, Tallinn, Estonia. pp.60-82, ⟨10.1007/978-3-319-67104-8_4⟩, 2016
    Online Konferenz
  11. Li, Xueqing ; Ma, Kaisheng ; et al.
    In: IFIP Advances in Information and Communication Technology ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC) ; https://hal.inria.fr/hal-01675201 ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC), Sep 2016, Tallinn, Estonia. pp.1-23, ⟨10.1007/978-3-319-67104-8_1⟩, 2016
    Online Konferenz
  12. Tenace, Valerio ; Calimera, Andrea ; et al.
    In: IFIP Advances in Information and Communication Technology ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC) ; https://hal.inria.fr/hal-01675195 ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC), Sep 2016, Tallinn, Estonia. pp.60-82, ⟨10.1007/978-3-319-67104-8_4⟩, 2016
    Online Konferenz
  13. Li, Xueqing ; Ma, Kaisheng ; et al.
    In: IFIP Advances in Information and Communication Technology ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC) ; https://hal.inria.fr/hal-01675201 ; 24th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSISOC), Sep 2016, Tallinn, Estonia. pp.1-23, ⟨10.1007/978-3-319-67104-8_1⟩, 2016
    Online Konferenz
  14. Ajayi, Tutu ; Kamineni, Sumanth ; et al.
    In: IFIP Advances in Information and Communication Technology ; 28th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-03759730 ; 28th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2020, Salt Lake City, UT, United States. pp.65-85, ⟨10.1007/978-3-030-81641-4_4⟩, 2020
    Online Konferenz
  15. Ajayi, Tutu ; Kamineni, Sumanth ; et al.
    In: IFIP Advances in Information and Communication Technology ; 28th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-03759730 ; 28th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2020, Salt Lake City, UT, United States. pp.65-85, ⟨10.1007/978-3-030-81641-4_4⟩, 2020
    Online Konferenz
  16. Jailin, T ; Tardif, Nicolas ; et al.
    In: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics ; https://hal.science/hal-02443369 ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, Jun 2019, Reno, United States. ⟨10.1007/978-3-030-30098-2_7⟩, 2019
    Online Konferenz
  17. Jailin, T ; Tardif, Nicolas ; et al.
    In: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics ; https://hal.science/hal-02443369 ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, Jun 2019, Reno, United States. ⟨10.1007/978-3-030-30098-2_7⟩, 2019
    Online Konferenz
  18. Jailin, T ; Tardif, Nicolas ; et al.
    In: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics ; https://hal.science/hal-02443369 ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, Jun 2019, Reno, United States. ⟨10.1007/978-3-030-30098-2_7⟩, 2019
    Online Konferenz
  19. Jailin, T ; Tardif, Nicolas ; et al.
    In: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics ; https://hal.science/hal-02443369 ; 2019 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, Jun 2019, Reno, United States. ⟨10.1007/978-3-030-30098-2_7⟩, 2019
    Online Konferenz
  20. Cadareanu, Patsy ; Gore, Ganesh ; et al.
    In: IFIP Advances in Information and Communication Technology ; 27th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC) ; https://hal.inria.fr/hal-03476610 ; 27th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2019, Cusco, Peru. pp.307-322, ⟨10.1007/978-3-030-53273-4_14⟩, 2019
    Online Konferenz
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