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- 010302 applied physics 35 Treffer
- composite material 25 Treffer
- condensed matter physics 15 Treffer
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- mechanical engineering 13 Treffer
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45 weitere Werte:
- mechanics of materials 12 Treffer
- business 11 Treffer
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- joint (geology) 6 Treffer
- soldering 6 Treffer
- adhesive 5 Treffer
- fracture mechanics 5 Treffer
- materials chemistry 5 Treffer
- visual_art 5 Treffer
- visual_art.visual_art_medium 5 Treffer
- 010305 fluids & plasmas 4 Treffer
- 010306 general physics 4 Treffer
- adhesion 4 Treffer
- bending 4 Treffer
- ceramics and composites 4 Treffer
- chemistry.chemical_classification 4 Treffer
- chemistry.chemical_compound 4 Treffer
- computingmilieux_miscellaneous 4 Treffer
- double cantilever beam 4 Treffer
- fracture toughness 4 Treffer
- power module 4 Treffer
- stress (mechanics) 4 Treffer
- structural engineering 4 Treffer
- substrate (electronics) 4 Treffer
- surfaces, coatings and films 4 Treffer
- temperature cycling 4 Treffer
- article 3 Treffer
- atomic and molecular physics, and optics 3 Treffer
- chemical engineering 3 Treffer
- composite number 3 Treffer
- engineering 3 Treffer
- engineering.material 3 Treffer
- epoxy 3 Treffer
- flexural strength 3 Treffer
- heat sink 3 Treffer
Verlag
- elsevier bv 12 Treffer
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- springer science and business media llc 3 Treffer
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13 weitere Werte:
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- mdpi 1 Treffer
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- sage publications 1 Treffer
- the electrochemical society 1 Treffer
- trans tech publications, ltd. 1 Treffer
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- 日本複合材料学会 1 Treffer
Publikation
- materials 3 Treffer
- engineering fracture mechanics 2 Treffer
- journal of electronic materials 2 Treffer
- journal of the mechanics and physics of solids 2 Treffer
- materials today: proceedings 2 Treffer
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23 weitere Werte:
- 2017 16th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm) 1 Treffer
- 2018 17th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm) 1 Treffer
- 2018 25th international conference "mixed design of integrated circuits and system" (mixdes) 1 Treffer
- 2018 ieee 68th electronic components and technology conference (ectc) 1 Treffer
- 2018 international conference on electronics packaging and imaps all asia conference (icep-iaac) 1 Treffer
- 2019 20th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime) 1 Treffer
- advanced composite materials 1 Treffer
- composites part a: applied science and manufacturing 1 Treffer
- ecs transactions 1 Treffer
- ieee transactions on device and materials reliability 1 Treffer
- inorganic materials: applied research 1 Treffer
- journal of applied physics 1 Treffer
- journal of composite materials 1 Treffer
- journal of electronic packaging 1 Treffer
- journal of materials research and technology 1 Treffer
- journal of materials science: materials in electronics 1 Treffer
- journal of nano research 1 Treffer
- materials research bulletin 1 Treffer
- microelectronics reliability 1 Treffer
- modern physics letters b 1 Treffer
- physical review b 1 Treffer
- results in physics 1 Treffer
- spie proceedings 1 Treffer
Sprache
44 Treffer
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In: Journal of Materials Research and Technology, Jg. 9 (2020-05-01), S. 5922-5933Online unknownZugriff:
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In: Materials, Jg. 9 (2016-11-01), Heft 11Online unknownZugriff:
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In: Journal of Composite Materials, Jg. 41 (2007-04-01), S. 931-950Online unknownZugriff:
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In: Advanced Composite Materials, Jg. 30 (2020-12-30), Heft 4, S. 396-408Online unknownZugriff:
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In: Journal of Electronic Materials, Jg. 50 (2021-01-28), S. 2117-2128Online unknownZugriff:
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In: Materials Today: Proceedings, Jg. 21 (2020), S. 1094-1098Online unknownZugriff:
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In: Materials Today: Proceedings, Jg. 22 (2020), S. 806-810Online unknownZugriff:
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In: Journal of the Mechanics and Physics of Solids, Jg. 123 (2019-02-01), S. 315-331Online unknownZugriff:
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In: Engineering Fracture Mechanics, Jg. 199 (2018-08-01), S. 730-738Online unknownZugriff:
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In: Journal of Nano Research, Jg. 51 (2018-02-01), S. 48-60Online unknownZugriff:
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In: Engineering Fracture Mechanics, Jg. 178 (2017-06-01), S. 1-13Online unknownZugriff:
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In: Journal of Materials Science: Materials in Electronics, Jg. 28 (2016-10-04), S. 1769-1776Online unknownZugriff:
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In: IEEE Transactions on Device and Materials Reliability, Jg. 16 (2016-09-01), S. 345-359Online unknownZugriff:
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In: ECS Transactions, Jg. 75 (2016-08-24), S. 145-152Online unknownZugriff:
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In: Journal of the Mechanics and Physics of Solids, Jg. 141 (2020-08-01), S. 103965-103965Online unknownZugriff:
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In: Journal of Electronic Materials, Jg. 45 (2015-11-09), S. 473-485Online unknownZugriff:
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In: Physical Review B, Jg. 97 (2018-02-05)Online unknownZugriff: