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In: Micromachines, Jg. 11 (2020), Heft 1Online unknownZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 10 (2020-11-01), S. 1902-1912Online unknownZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 9 (2019-09-01), S. 1730-1740Online unknownZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 9 (2019-09-01), S. 1872-1887Online unknownZugriff:
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In: Composite Structures, Jg. 208 (2019), S. 377-384Online unknownZugriff:
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In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020-06-01Online unknownZugriff:
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In: International Symposium on Microelectronics, Jg. 2017 (2017-10-01), S. 194-200Online unknownZugriff:
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In: 2019 IEEE 8th International Workshop on Advances in Sensors and Interfaces (IWASI), 2019-06-01Online unknownZugriff:
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In: Technologies, 2019-02-06Online unknownZugriff:
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In: Advanced Materials, Jg. 32 (2019-11-19), S. 1905279-1905279Online unknownZugriff:
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In: 2018 IEEE International Symposium on Circuits and Systems (ISCAS), 2018-05-01Online unknownZugriff:
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In: Materials, Jg. 11 (2018), Heft 2Online unknownSiehe Detailanzeige für VolltextZugriff:
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In: Proceedings of the 35th International Conference on Computer-Aided Design, 2016-11-07Online unknownZugriff:
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In: IETE Technical Review, Jg. 35 (2018-10-16), S. 85-96Online unknownZugriff:
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In: Advanced Materials, Jg. 32 (2019-11-29), S. 1902684-1902684Online unknownZugriff:
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In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016-05-01Online unknownZugriff: