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Temperature-Dependent Modeling and Crosstalk Analysis in Mixed Carbon Nanotube Bundle Interconnects.In: Journal of Electronic Materials, Jg. 46 (2017-08-01), Heft 8, S. 5324-5337Online academicJournalZugriff:
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In: Integration: The VLSI Journal, Jg. 80 (2021-09-01), S. 29-40academicJournalZugriff:
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In: Journal of Circuits, Systems & Computers, Jg. 24 (2015-12-01), Heft 10, S. -1- (15S.)academicJournalZugriff:
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In: IEEE Transactions on Electromagnetic Compatibility, Jg. 56 (2014-12-01), Heft 6, S. 1666-1673Online academicJournalZugriff: