Suchergebnisse
UB Katalog
Artikel & mehr
Suchmaske
Suchergebnisse einschränken oder erweitern
Aktive Suchfilter
Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- electronique des semiconducteurs. microelectronique. optoelectronique. dispositifs a l'etat solide 15 Treffer
- semiconductor electronics. microelectronics. optoelectronics. solid state devices 15 Treffer
- circuits integres 14 Treffer
- conception. technologies. analyse fonctionnement. essais 14 Treffer
- design. technologies. operation analysis. testing 14 Treffer
-
45 weitere Werte:
- integrated circuits 14 Treffer
- circuits hyperfrequences, circuits integres hyperfrequences, lignes de transmission hyperfrequences, circuits a ondes submillimetriques 10 Treffer
- electronic packaging 10 Treffer
- microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits 10 Treffer
- packaging electronico 10 Treffer
- packaging electronique 10 Treffer
- circuits electroniques 9 Treffer
- electronic circuits 9 Treffer
- insertion loss 9 Treffer
- perdida insercion 9 Treffer
- perte insertion 9 Treffer
- appareillage electronique et fabrication. composants passifs, circuits imprimes, connectique 8 Treffer
- electronic equipment and fabrication. passive components, printed wiring boards, connectics 8 Treffer
- ligne transmission 8 Treffer
- linea transmision 8 Treffer
- transmission line 8 Treffer
- circuits optiques et optoelectroniques 6 Treffer
- conexion espesada 6 Treffer
- optical and optoelectronic circuits 6 Treffer
- return loss 6 Treffer
- assemblage circuit integre 5 Treffer
- circuit integre 5 Treffer
- circuito integrado 5 Treffer
- evaluacion prestacion 5 Treffer
- evaluation performance 5 Treffer
- experimental result 5 Treffer
- integrated circuit 5 Treffer
- integrated circuit bonding 5 Treffer
- interconexion 5 Treffer
- interconnection 5 Treffer
- interconnexion 5 Treffer
- millimetric wave 5 Treffer
- onda milimetrica 5 Treffer
- onde millimetrique 5 Treffer
- performance evaluation 5 Treffer
- resultado experimental 5 Treffer
- resultat experimental 5 Treffer
- capa multiple 4 Treffer
- caracteristica electrica 4 Treffer
- caracteristique electrique 4 Treffer
- circuit hyperfrequence 4 Treffer
- circuito hiperfrecuencia 4 Treffer
- comparative study 4 Treffer
- connexion par billes 4 Treffer
- coplanar waveguide (cpw) 4 Treffer
Sprache
20 Treffer
-
In: IEEE transactions on advanced packaging, Jg. 30 (2007), Heft 3, S. 566-569Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 25 (2002), Heft 3, S. 459-466Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 31 (2008), Heft 4, S. 861-872Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 31 (2008), Heft 2, S. 351-356Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 29 (2006), Heft 3, S. 409-414Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 30 (2007), Heft 1, S. 34-37Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 33 (2010), Heft 2, S. 362-369Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 31 (2008), Heft 3, S. 527-535Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 26 (2003), Heft 3, S. 248-254Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 31 (2008), Heft 4, S. 855-860Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 30 (2007), Heft 3, S. 369-376Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 30 (2007), Heft 3, S. 521-525Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 29 (2006), Heft 4, S. 804-809Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 25 (2002), Heft 3, S. 385-392Online academicJournalZugriff:
-
In: Chip Package Codesign Workshop, Jg. 24 (2001), Heft 3, S. 255-259Online KonferenzZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 24 (2001), Heft 4, S. 429-433Online KonferenzZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 32 (2009), Heft 1, S. 216-222Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 32 (2009), Heft 1, S. 101-108Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 27 (2004), Heft 3, S. 497-507Online academicJournalZugriff:
-
In: IEEE transactions on advanced packaging, Jg. 26 (2003), Heft 4, S. 385-391Online academicJournalZugriff: