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Weniger Treffer
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Schlagwort
- soldering 641 Treffer
- metallurgy 215 Treffer
- temperature cycling 206 Treffer
- electrical and electronic engineering 174 Treffer
- flip chip 171 Treffer
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45 weitere Werte:
- business 157 Treffer
- condensed matter physics 157 Treffer
- 02 engineering and technology 147 Treffer
- business.industry 146 Treffer
- electronic, optical and magnetic materials 134 Treffer
- 01 natural sciences 132 Treffer
- 0103 physical sciences 128 Treffer
- 010302 applied physics 128 Treffer
- electronic packaging 117 Treffer
- finite element method 117 Treffer
- joint (geology) 112 Treffer
- stress (mechanics) 111 Treffer
- printed circuit board 108 Treffer
- 0210 nano-technology 104 Treffer
- 021001 nanoscience & nanotechnology 104 Treffer
- microstructure 97 Treffer
- mechanical engineering 94 Treffer
- mechanics of materials 92 Treffer
- visual_art 91 Treffer
- visual_art.visual_art_medium 91 Treffer
- chemistry 89 Treffer
- intermetallic 88 Treffer
- general materials science 87 Treffer
- electronic engineering 86 Treffer
- integrated circuit packaging 84 Treffer
- engineering 82 Treffer
- reflow soldering 82 Treffer
- creep 81 Treffer
- structural engineering 78 Treffer
- solder paste 72 Treffer
- interconnection 65 Treffer
- law 65 Treffer
- law.invention 65 Treffer
- reliability (semiconductor) 65 Treffer
- atomic and molecular physics, and optics 64 Treffer
- chip-scale package 57 Treffer
- chemistry.chemical_element 55 Treffer
- engineering.material 55 Treffer
- eutectic system 55 Treffer
- substrate (building) 55 Treffer
- die (integrated circuit) 53 Treffer
- shear strength 52 Treffer
- ball (bearing) 49 Treffer
- epoxy 49 Treffer
- surfaces, coatings and films 47 Treffer
Verlag
- ieee 505 Treffer
- elsevier bv 72 Treffer
- springer science and business media llc 70 Treffer
- institute of electrical and electronics engineers (ieee) 40 Treffer
- japan society of mechanical engineers 28 Treffer
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45 weitere Werte:
- asmedc 25 Treffer
- imaps - international microelectronics assembly and packaging society 20 Treffer
- japan institute of electronics packaging 19 Treffer
- emerald 18 Treffer
- american society of mechanical engineers 16 Treffer
- japan institute of metals 15 Treffer
- trans tech publications, ltd. 12 Treffer
- iop publishing 10 Treffer
- asme international 9 Treffer
- informa uk limited 8 Treffer
- elsevier 6 Treffer
- aip publishing 5 Treffer
- wiley 5 Treffer
- springer international publishing 4 Treffer
- the korean microelectronics and packaging society 4 Treffer
- asm international 3 Treffer
- hal ccsd 3 Treffer
- intech 3 Treffer
- mdpi ag 3 Treffer
- organizing committee 1998 iemt/imc symposium 3 Treffer
- spie 3 Treffer
- springer us 3 Treffer
- the korean welding and joining society 3 Treffer
- chinese journal of mechanical engineering 2 Treffer
- inderscience publishers 2 Treffer
- mcb university press 2 Treffer
- oxford university press (oup) 2 Treffer
- sciencedomain international 2 Treffer
- springer netherlands 2 Treffer
- the materials research society of korea 2 Treffer
- world scientific pub co pte lt 2 Treffer
- allerton press 1 Treffer
- american chemical society (acs) 1 Treffer
- american institute of aeronautics and astronautics 1 Treffer
- american institute of physics 1 Treffer
- associacao brasileira de metalurgia e materiais (abm); associacao brasileira de ceramica (abc); associacao brasileira de polimeros (abpol) 1 Treffer
- astm international 1 Treffer
- author(s) 1 Treffer
- china science publishing & media ltd. 1 Treffer
- crc press 1 Treffer
- editorial csic 1 Treffer
- hindawi limited 1 Treffer
- institute of electrical and electronics engineers 1 Treffer
- springer 1 Treffer
- wiley subscription services 1 Treffer
Publikation
- microelectronics reliability 30 Treffer
- journal of electronic materials 25 Treffer
- journal of materials science: materials in electronics 21 Treffer
- journal of japan institute of electronics packaging 15 Treffer
- materials transactions 15 Treffer
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45 weitere Werte:
- 2021 22nd international conference on electronic packaging technology (icept) 13 Treffer
- soldering & surface mount technology 12 Treffer
- ieee transactions on components, packaging and manufacturing technology 11 Treffer
- international symposium on microelectronics 11 Treffer
- proceedings electronic components and technology, 2005. ectc '05. 11 Treffer
- 2018 19th international conference on electronic packaging technology (icept) 10 Treffer
- 2018 ieee 68th electronic components and technology conference (ectc) 10 Treffer
- 56th electronic components and technology conference 2006 10 Treffer
- ieee transactions on components and packaging technologies 10 Treffer
- 2008 58th electronic components and technology conference 9 Treffer
- 2009 international conference on electronic packaging technology & high density packaging 9 Treffer
- 2011 ieee 61st electronic components and technology conference (ectc) 9 Treffer
- 2014 15th international conference on electronic packaging technology 9 Treffer
- 2017 18th international conference on electronic packaging technology (icept) 9 Treffer
- journal of electronic packaging 9 Treffer
- 1998 proceedings. 48th electronic components and technology conference (cat. no.98ch36206) 8 Treffer
- 2004 proceedings. 54th electronic components and technology conference (ieee cat. no.04ch37546) 8 Treffer
- 2007 proceedings 57th electronic components and technology conference 8 Treffer
- ieee transactions on electronics packaging manufacturing 8 Treffer
- the proceedings of the jsme annual meeting 8 Treffer
- 2001 proceedings. 51st electronic components and technology conference (cat. no.01ch37220) 7 Treffer
- 2009 59th electronic components and technology conference 7 Treffer
- 2012 ieee 62nd electronic components and technology conference 7 Treffer
- 2016 17th international conference on electronic packaging technology (icept) 7 Treffer
- ieee transactions on advanced packaging 7 Treffer
- microelectronics international 7 Treffer
- the proceedings of the computational mechanics conference 7 Treffer
- 1997 proceedings 47th electronic components and technology conference 6 Treffer
- 2016 ieee 66th electronic components and technology conference (ectc) 6 Treffer
- 2019 18th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm) 6 Treffer
- 2019 20th international conference on electronic packaging technology(icept) 6 Treffer
- 2020 ieee 70th electronic components and technology conference (ectc) 6 Treffer
- electronic and photonic packaging, electrical systems design and photonics, and nanotechnology 6 Treffer
- journal of alloys and compounds 6 Treffer
- materials science forum 6 Treffer
- microelectronic engineering 6 Treffer
- mrs proceedings 6 Treffer
- 1995 proceedings. 45th electronic components and technology conference 5 Treffer
- microelectronics and reliability 3 Treffer
- 2004 24th internationcal conference on microelectronics (nis, serbia and montenegro, 16-19 may 20) 1 Treffer
- 54th electronic components & technology conference (las vegas nv, 1-4 june 2004) 1 Treffer
- itherm 2004 (ninth intersociety conference on thermal and thermomechanical phenomena in electronic systems) 1 Treffer
- journal of materials science. materials in electronics 1 Treffer
- polymer engineering and science 1 Treffer
- proceedings - electronic components conference 1 Treffer
Sprache
980 Treffer
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In: Microelectronics and reliability, Jg. 49 (2009), Heft 1, S. 79-85academicJournalZugriff:
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In: Journal of materials science. Materials in electronics, Jg. 22 (2011), Heft 9, S. 1443-1449Online academicJournalZugriff:
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In: Microelectronics international, Jg. 22 (2005), Heft 1, S. 34-42Online academicJournalZugriff:
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In: Journal of Materials Science: Materials in Electronics, Jg. 32 (2021-05-16), S. 15453-15465Online unknownSiehe Detailanzeige für VolltextZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 11 (2021), S. 43-50Online unknownZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 10 (2020-12-01), S. 2118-2124Online unknownZugriff:
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In: Journal of Electronic Materials, Jg. 50 (2020-11-05), S. 263-282Online unknownZugriff:
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In: Journal of Materials Science: Materials in Electronics, Jg. 31 (2020-08-04), S. 15575-15588Online unknownSiehe Detailanzeige für VolltextZugriff:
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In: MATERIALS TRANSACTIONS, Jg. 62 (2021-02-01), S. 205-212Online unknownZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14Online unknownZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14Online unknownZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14Online unknownZugriff:
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In: Journal of Electronic Materials, Jg. 48 (2019-07-16), S. 6866-6871Online unknownZugriff:
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In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021-06-01Online unknownZugriff:
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In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021-06-01Online unknownZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14Online unknownZugriff:
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In: Journal of Materials Science: Materials in Electronics, Jg. 30 (2019-07-22), S. 15184-15197Online unknownSiehe Detailanzeige für VolltextZugriff:
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In: Microelectronics Reliability, Jg. 98 (2019-07-01), S. 1-9Online unknownZugriff: