Suchergebnisse
UB Katalog
Artikel & mehr
Suchmaske
Suchergebnisse einschränken oder erweitern
Aktive Suchfilter
Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- cmos image sensors 2 Treffer
- complementary metal oxide semiconductors 2 Treffer
- wafer bonding 2 Treffer
- wafer level packaging 2 Treffer
- 3-d integrated circuits 1 Treffer
-
38 weitere Werte:
- 3-d integration 1 Treffer
- arrays 1 Treffer
- biosensors 1 Treffer
- bonding processes 1 Treffer
- charge coupled devices 1 Treffer
- discrete wavelet transforms 1 Treffer
- fabrication 1 Treffer
- gallium arsenide 1 Treffer
- hybrid securities 1 Treffer
- image coding 1 Treffer
- image compression 1 Treffer
- image quality 1 Treffer
- image segmentation 1 Treffer
- integrated circuit interconnections 1 Treffer
- integrated circuits 1 Treffer
- interfacial bonding 1 Treffer
- lab-on-a-chip (loc) 1 Treffer
- labs on a chip 1 Treffer
- microelectromechanical systems 1 Treffer
- microfluidics 1 Treffer
- noise 1 Treffer
- packaging 1 Treffer
- photodiodes 1 Treffer
- plant hybridization 1 Treffer
- process 1 Treffer
- reliability 1 Treffer
- sealing (technology) 1 Treffer
- semiconductor wafer bonding 1 Treffer
- signal processing 1 Treffer
- silicon 1 Treffer
- silicon-on-insulator 1 Treffer
- thermal analysis 1 Treffer
- three-dimensional displays 1 Treffer
- three-dimensional integrated circuits 1 Treffer
- through-silicon via (tsv) 1 Treffer
- wafer scale integration 1 Treffer
- wafer-level packaging 1 Treffer
- wet etching 1 Treffer
Sprache
4 Treffer
-
In: IEEE Transactions on Components, Packaging & Manufacturing Technology, Jg. 9 (2019-04-01), Heft 4, S. 624-632Online academicJournalZugriff:
-
In: IEEE Transactions on Components, Packaging & Manufacturing Technology, Jg. 4 (2014-02-01), Heft 2, S. 198-208Online academicJournalZugriff:
-
In: IEEE Transactions on Components, Packaging & Manufacturing Technology, Jg. 9 (2019-09-01), Heft 9, S. 1904-1911Online academicJournalZugriff:
-
In: IEEE Transactions on Components, Packaging & Manufacturing Technology, Jg. 3 (2013-12-01), Heft 12, S. 2022-2028Online academicJournalZugriff: