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Weniger Treffer
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- conductors 3 Treffer
- coils 2 Treffer
- components, circuits, devices and systems 2 Treffer
- fields, waves and electromagnetics 2 Treffer
- frequency 2 Treffer
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29 weitere Werte:
- analytical models 1 Treffer
- benchmark testing 1 Treffer
- capacitance 1 Treffer
- computational modeling 1 Treffer
- conducting materials 1 Treffer
- conductivity 1 Treffer
- cryogenic fluids 1 Treffer
- demo 1 Treffer
- design 1 Treffer
- dielectrics 1 Treffer
- discharges (electric) 1 Treffer
- electromagnetic analysis 1 Treffer
- electromagnetic propagation 1 Treffer
- equivalent circuits 1 Treffer
- fusion magnet 1 Treffer
- green's function methods 1 Treffer
- heating systems 1 Treffer
- insulator testing 1 Treffer
- integrated circuit interconnections 1 Treffer
- iterative algorithms 1 Treffer
- maxwell equations 1 Treffer
- metal-insulator structures 1 Treffer
- microstrip 1 Treffer
- numerical models 1 Treffer
- quench propagation 1 Treffer
- resistors 1 Treffer
- superconducting magnets 1 Treffer
- transient analysis 1 Treffer
- voltage 1 Treffer
Publikation
- ieee transactions on applied superconductivity, applied superconductivity, ieee transactions on, ieee trans. appl. supercond. 2 Treffer
- proceedings of the ieee 1998 international interconnect technology conference (cat. no.98ex102), interconnect technology conference, 1998. proceedings of the ieee 1998 international, interconnect technology 1 Treffer
- proceedings of the ieee 2000 international interconnect technology conference (cat. no.00ex407), interconnect technology conference, 2000. proceedings of the ieee 2000 international, interconnect technology 1 Treffer
4 Treffer
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In: IEEE Transactions on Applied Superconductivity, Jg. 34 (2024-08-01), Heft 5, S. 1-5Online academicJournalZugriff:
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In: IEEE Transactions on Applied Superconductivity, Jg. 28 (2018-04-01), Heft 3, S. 1-1Online academicJournalZugriff:
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In: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407), 2000, S. 167-169KonferenzZugriff:
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In: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102), 1998, S. 178-180KonferenzZugriff: