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Verlag
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16 Treffer
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In: Nano Research, Jg. 14 (2020-07-25), S. 1768-1783Online unknownZugriff:
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In: Russian Microelectronics, Jg. 48 (2019-05-01), S. 187-196Online unknownZugriff:
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In: Microelectronics Reliability, Jg. 126 (2021-11-01), S. 114210-114210Online unknownZugriff:
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In: Semiconductors, Jg. 44 (2010-12-01), S. 1662-1668Online unknownZugriff:
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In: Microelectronic Engineering, Jg. 84 (2007-09-01), S. 1845-1852Online unknownZugriff:
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In: Microelectronic Engineering, 2003-06-01, S. 390-396Online unknownZugriff:
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In: Applied Surface Science, Jg. 73 (1993-11-01), S. 1-5Online unknownZugriff:
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In: Solid-State Electronics, Jg. 31 (1988-11-01), S. 1619-1627Online unknownZugriff:
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In: Solid-State Electronics, Jg. 185 (2021-11-01), S. 108037-108037Online unknownZugriff:
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In: Microelectronic Engineering, Jg. 148 (2015-12-01), S. 85-90Online unknownZugriff:
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In: Microelectronics Reliability, Jg. 67 (2016-12-01), S. 64-73Online unknownZugriff:
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In: Microelectronic Engineering, Jg. 86 (2009-07-01), S. 1520-1528Online unknownZugriff:
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In: Microelectronic Engineering, Jg. 32 (1996-09-01), S. 15-30Online unknownZugriff:
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Device-level and module-level three-dimensional integrated circuits created using oblique processingIn: Journal of Micro/Nanolithography, MEMS, and MOEMS, Jg. 15 (2016-08-12), S. 034504-34504Online unknownZugriff:
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In: Microelectronic Engineering, Jg. 19 (1992-09-01), S. 161-164Online unknownZugriff: