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In: Sensors (Basel, Switzerland), Jg. 19 (2019-01-24), Heft 7Online unknownZugriff:
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In: 2016 International Conference on Electronics Packaging (ICEP), 2016-04-01Online unknownZugriff:
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In: Japanese Journal of Applied Physics, Jg. 55 (2016-03-17), S. 04EM06Online unknownZugriff: