Suchergebnisse
UB Katalog
Artikel & mehr
Suchmaske
Suchergebnisse einschränken oder erweitern
Aktive Suchfilter
Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- engineered materials, dielectrics and plasmas 567 Treffer
- soldering 217 Treffer
- electronics packaging 181 Treffer
- fields, waves and electromagnetics 173 Treffer
- communication, networking and broadcast technologies 161 Treffer
-
45 weitere Werte:
- power, energy and industry applications 144 Treffer
- packaging 141 Treffer
- signal processing and analysis 139 Treffer
- computing and processing 116 Treffer
- testing 112 Treffer
- lead 107 Treffer
- assembly 105 Treffer
- temperature 103 Treffer
- aerospace 98 Treffer
- robotics and control systems 94 Treffer
- fatigue 90 Treffer
- electronic packaging thermal management 84 Treffer
- reliability 79 Treffer
- transportation 74 Treffer
- flip chip 71 Treffer
- engineering profession 66 Treffer
- costs 64 Treffer
- substrates 64 Treffer
- environmentally friendly manufacturing techniques 60 Treffer
- bonding 59 Treffer
- stress 57 Treffer
- silicon 55 Treffer
- finite element analysis 51 Treffer
- predictive models 50 Treffer
- bioengineering 47 Treffer
- copper 47 Treffer
- chip scale packaging 45 Treffer
- thermomechanical processes 44 Treffer
- bga 43 Treffer
- printed circuits 43 Treffer
- finite element methods 40 Treffer
- thermal stresses 40 Treffer
- aging 38 Treffer
- capacitive sensors 38 Treffer
- electric shock 37 Treffer
- general topics for engineers 36 Treffer
- ceramics 35 Treffer
- integrated circuit packaging 35 Treffer
- materials reliability 35 Treffer
- integrated circuit interconnections 34 Treffer
- intermetallic 34 Treffer
- radio frequency 34 Treffer
- strain 34 Treffer
- analytical models 33 Treffer
- semiconductor device packaging 33 Treffer
Verlag
- ieee 683 Treffer
- japan institute of electronics packaging 17 Treffer
- imaps-europe 9 Treffer
- smta 7 Treffer
- the japan institute of electronics packaging 2 Treffer
-
7 weitere Werte:
- european association for antennas and propagation 1 Treffer
- european microwave association 1 Treffer
- jiep 1 Treffer
- jsps 191st committee on innovative interface bonding technology 1 Treffer
- osa 1 Treffer
- the institute of electronics information and communication engineers (ieice) of japan 1 Treffer
- usnc-ursi 1 Treffer
Publikation
- 2000 proceedings. 50th electronic components and technology conference (cat. no.00ch37070), electronic components & technology conference, 2000. 2000 proceedings. 50th, electronic components and technology 32 Treffer
- 2007 proceedings 57th electronic components and technology conference, electronic components and technology conference, 2007. ectc '07. proceedings. 57th 31 Treffer
- proceedings electronic components and technology, 2005. ectc '05., electronic components and technology conference, 2005. proceedings. 55th, electronic components and technology 30 Treffer
- 2001 proceedings. 51st electronic components and technology conference (cat. no.01ch37220), electronic components and technology conference, 2001. proceedings., 51st, electronic components and technology 29 Treffer
- 56th electronic components and technology conference 2006, electronic components and technology conference, 2006. proceedings. 56th, electronic components & technology 27 Treffer
-
45 weitere Werte:
- 2004 proceedings. 54th electronic components and technology conference (ieee cat. no.04ch37546), electronic components and technology conference, 2004. proceedings. 54th, electronic components and technology 25 Treffer
- 2021 22nd international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2021 22nd international conference on 23 Treffer
- 52nd electronic components and technology conference 2002. (cat. no.02ch37345), electronic components and technology conference, 2002. proceedings. 52nd, electronic components and technology conference 23 Treffer
- 1999 proceedings. 49th electronic components and technology conference (cat. no.99ch36299), electronic components and technology conference, 1999. 1999 proceedings. 49th, electronic components and technology 21 Treffer
- 2008 58th electronic components and technology conference, electronic components and technology conference, 2008. ectc 2008. 58th 21 Treffer
- 2009 59th electronic components and technology conference, electronic components and technology conference, 2009. ectc 2009. 59th 20 Treffer
- 2014 ieee 64th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2014 ieee 64th 19 Treffer
- 2022 23rd international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2022 23rd international conference on 19 Treffer
- 1995 proceedings. 45th electronic components and technology conference, electronic components and technology conference, 1995. proceedings., 45th, electronic components and technology 16 Treffer
- 2020 21st international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2020 21st international conference on 14 Treffer
- 2022 ieee 72nd electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2022 ieee 72nd, ectc 13 Treffer
- 1996 proceedings 46th electronic components and technology conference, electronic components and technology conference, 1996. proceedings., 46th, electronic components and technology 12 Treffer
- 1997 proceedings 47th electronic components and technology conference, electronic components and technology conference, 1997. proceedings., 47th, electronic components and technology 12 Treffer
- 2009 11th electronics packaging technology conference, electronics packaging technology conference, 2009. eptc '09. 11th 12 Treffer
- 2019 18th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2019 18th ieee intersociety conference on 12 Treffer
- 2018 ieee 20th electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2018 ieee 20th 11 Treffer
- 2019 20th international conference on electronic packaging technology(icept), electronic packaging technology(icept), 2019 20th international conference on 11 Treffer
- 2023 ieee 73rd electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2023 ieee 73rd, ectc 11 Treffer
- ieee access, access, ieee 10 Treffer
- 2008 33rd ieee/cpmt international electronics manufacturing technology conference (iemt), electronic manufacturing technology symposium (iemt), 2008 33rd ieee/cpmt international 9 Treffer
- 2023 ieee 25th electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2023 ieee 25th 9 Treffer
- 2017 16th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2017 16th ieee intersociety conference on 8 Treffer
- 2018 17th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2018 17th ieee intersociety conference on 8 Treffer
- 2019 22nd european microelectronics and packaging conference & exhibition (empc), european microelectronics and packaging conference & exhibition (empc), 2019 22nd 8 Treffer
- 2021 20th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2021 20th ieee intersociety conference on 8 Treffer
- 2022 ieee 24th electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2022 ieee 24th 8 Treffer
- 53rd electronic components and technology conference, 2003. proceedings., electronic components and technology conference, 2003. proceedings. 53rd 8 Treffer
- 2020 19th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2020 19th ieee intersociety conference on 7 Treffer
- 2022 21st ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2022 21st ieee intersociety conference on 7 Treffer
- 2012 7th international microsystems, packaging, assembly and circuits technology conference (impact), microsystems, packaging, assembly and circuits technology conference (impact), 2012 7th international 5 Treffer
- 2021 ieee 23rd electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2021 ieee 23rd 5 Treffer
- 1994 proceedings. 44th electronic components and technology conference, electronic components and technology conference, 1994. proceedings., 44th, electronic components and technology 4 Treffer
- 2016 ieee 37th international electronics manufacturing technology (iemt) & 18th electronics materials and packaging (emap) conference, electronics manufacturing technology (iemt) & 18th electronics materials and packaging (emap) conference, 2016 ieee 37th international 4 Treffer
- 2017 international conference on electronics packaging (icep), electronics packaging (icep), 2017 international conference on 4 Treffer
- 2018 ieee international symposium on the physical and failure analysis of integrated circuits (ipfa), physical and failure analysis of integrated circuits (ipfa), 2018 ieee international symposium on the 4 Treffer
- 2018 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iaac), 2018 international conference on 4 Treffer
- 2019 ieee 21st electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2019 ieee 21st 4 Treffer
- 2020 21st international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2020 21st international conference on 4 Treffer
- 2022 ieee 39th international electronics manufacturing technology conference (iemt), electronics manufacturing technology conference (iemt), 2022 ieee 39th international 4 Treffer
- 2024 international conference on electronics packaging (icep), electronics packaging (icep), 2024 international conference on 4 Treffer
- 2020 ieee 22nd electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2020 ieee 22nd 3 Treffer
- 2020 pan pacific microelectronics symposium (pan pacific), pan pacific microelectronics symposium (pan pacific), 2020 3 Treffer
- 2024 ieee 28th workshop on signal and power integrity (spi), signal and power integrity (spi), 2024 ieee 28th workshop on 3 Treffer
- first international ieee conference on polymers and adhesives in microelectronics and photonics. incorporating poly, pep & adhesives in electronics. proceedings (cat. no.01th8592), polymers and adhesives in microelectronics and photonics, 2001. first international ieee conference on, polymers and adhesives in microelectronics and photonics 3 Treffer
- fourteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2014 ieee intersociety conference on 3 Treffer
725 Treffer
-
In: 2024 International Conference on Electronics Packaging (ICEP), 2024-04-17, S. 1-2KonferenzZugriff:
-
In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023-05-30, S. 1-8KonferenzZugriff:
-
In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023-05-01, S. 656-660KonferenzZugriff:
-
In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023-12-05, S. 742-746KonferenzZugriff:
-
In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023-12-05, S. 674-677KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-5KonferenzZugriff:
-
In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023-12-05, S. 169-176KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-5KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-4KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-5KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-5KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-5KonferenzZugriff:
-
In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022-05-31, S. 1-6KonferenzZugriff:
-
In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022-05-31, S. 1-9KonferenzZugriff:
-
Low Temperature Formation of SAC-SnBi BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022-05-01, S. 1163-1171KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-3KonferenzZugriff:
-
In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023-05-01, S. 858-865KonferenzZugriff:
-
In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023-05-01, S. 1200-1204KonferenzZugriff:
-
In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14, S. 1-5KonferenzZugriff:
-
In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021-09-13, S. 1-8KonferenzZugriff: