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Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- copper 21 Treffer
- power, energy and industry applications 17 Treffer
- engineered materials, dielectrics and plasmas 16 Treffer
- bonding 12 Treffer
- signal processing and analysis 10 Treffer
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45 weitere Werte:
- computing and processing 9 Treffer
- photonics and electrooptics 9 Treffer
- ceramics 8 Treffer
- robotics and control systems 8 Treffer
- silver 8 Treffer
- fields, waves and electromagnetics 7 Treffer
- wires 7 Treffer
- aluminum 6 Treffer
- communication, networking and broadcast technologies 6 Treffer
- power electronics 6 Treffer
- reliability 6 Treffer
- transportation 6 Treffer
- aerospace 5 Treffer
- insulated gate bipolar transistors 5 Treffer
- lead 4 Treffer
- metallization 4 Treffer
- silicon 4 Treffer
- silicon carbide 4 Treffer
- surface treatment 4 Treffer
- temperature measurement 4 Treffer
- circuits 3 Treffer
- fatigue 3 Treffer
- heating 3 Treffer
- inductance 3 Treffer
- multichip modules 3 Treffer
- packaging 3 Treffer
- stress 3 Treffer
- testing 3 Treffer
- additive manufacturing 2 Treffer
- aluminum oxide 2 Treffer
- analytical models 2 Treffer
- atmosphere 2 Treffer
- automotive engineering 2 Treffer
- cooling 2 Treffer
- dbc 2 Treffer
- delamination 2 Treffer
- heating systems 2 Treffer
- load modeling 2 Treffer
- logic gates 2 Treffer
- metals 2 Treffer
- microassembly 2 Treffer
- plasma temperature 2 Treffer
- power mosfet 2 Treffer
- power semiconductor devices 2 Treffer
- semiconductor device packaging 2 Treffer
Verlag
Publikation
- 2004 ieee 35th annual power electronics specialists conference (ieee cat. no.04ch37551), power electronics specialists conference, 2004. pesc 04. 2004 ieee 35th annual, power electronics specialists conference 3 Treffer
- 2012 7th international conference on integrated power electronics systems (cips), integrated power electronics systems (cips), 2012 7th international conference on 3 Treffer
- proceedings of the 5th electronics system-integration technology conference (estc), electronics system-integration technology conference (estc), 2014 2 Treffer
- 11th international symposium on power semiconductor devices and ics. ispsd'99 proceedings (cat. no.99ch36312), power semiconductor devices and ics, 1999. ispsd '99. proceedings., the 11th international symposium on, power semiconductor devices and ics 1 Treffer
- 19th international workshop on thermal investigations of ics and systems (therminic), thermal investigations of ics and systems (therminic), 2013 19th international workshop on 1 Treffer
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27 weitere Werte:
- 2007 sixteenth ieee international symposium on the applications of ferroelectrics, applications of ferroelectrics, 2007. isaf 2007. sixteenth ieee international symposium on 1 Treffer
- 2008 international conference on electronic packaging technology & high density packaging, electronic packaging technology & high density packaging, 2008. icept-hdp 2008. international conference on 1 Treffer
- 2012 7th international microsystems, packaging, assembly and circuits technology conference (impact), microsystems, packaging, assembly and circuits technology conference (impact), 2012 7th international 1 Treffer
- 2013 eurpoean microelectronics packaging conference (empc), microelectronics packaging conference (empc) , 2013 european 1 Treffer
- 2013 ieee 63rd electronic components and technology conference, electronic components and technology conference (ectc), 2013 ieee 63rd 1 Treffer
- 2014 15th international conference on thermal, mechanical and mulit-physics simulation and experiments in microelectronics and microsystems (eurosime), thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on 1 Treffer
- 2014 16th european conference on power electronics and applications, power electronics and applications (epe'14-ecce europe), 2014 16th european conference on 1 Treffer
- 2014 ieee 16th electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2014 ieee 16th 1 Treffer
- 2015 17th european conference on power electronics and applications (epe'15 ecce-europe), power electronics and applications (epe'15 ecce-europe), 2015 17th european conference on 1 Treffer
- 2015 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iacc), 2015 international conference on 1 Treffer
- 2016 18th european conference on power electronics and applications (epe'16 ecce europe), power electronics and applications (epe'16 ecce europe), 2016 18th european conference on 1 Treffer
- 2016 6th electronic system-integration technology conference (estc), electronic system-integration technology conference (estc), 2016 6th 1 Treffer
- 2016 international conference on electronics packaging (icep), electronics packaging (icep), 2016 international conference on 1 Treffer
- 2017 imaps nordic conference on microelectronics packaging (nordpac), microelectronics packaging (nordpac), 2017 imaps nordic conference on 1 Treffer
- 2018 imaps nordic conference on microelectronics packaging (nordpac), microelectronics packaging (nordpac), 2018 imaps nordic conference on 1 Treffer
- 2018 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iaac), 2018 international conference on 1 Treffer
- 2018 second international symposium on 3d power electronics integration and manufacturing (3d-peim), 3d power electronics integration and manufacturing (3d-peim), 2018 second international symposium on 1 Treffer
- 2019 22nd european microelectronics and packaging conference & exhibition (empc), european microelectronics and packaging conference & exhibition (empc), 2019 22nd 1 Treffer
- 2020 ieee 70th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2020 ieee 70th 1 Treffer
- 2020 ieee 8th electronics system-integration technology conference (estc), electronics system-integration technology conference (estc), 2020 ieee 8th 1 Treffer
- 2022 international conference on electronics packaging (icep), electronics packaging (icep), 2022 international conference on 1 Treffer
- 3rd electronics system integration technology conference estc, electronic system-integration technology conference (estc), 2010 3rd 1 Treffer
- hiten 99. third european conference on high temperature electronics. (ieee cat. no.99ex372), high temperature electronics, 1999. hiten 99. the third european conference on, high temperature electronics 1 Treffer
- ieee transactions on advanced packaging, advanced packaging, ieee transactions on, ieee trans. adv. packag. 1 Treffer
- ieee transactions on device and materials reliability, device and materials reliability, ieee transactions on, ieee trans. device mater. relib. 1 Treffer
- ieee transactions on power electronics, power electronics, ieee transactions on, ieee trans. power electron. 1 Treffer
- seventeenth annual ieee semiconductor thermal measurement and management symposium (cat. no.01ch37189), semiconductor thermal measurement and management, 2001. seventeenth annual ieee symposium, semiconductor thermal measurement and management 1 Treffer
37 Treffer
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In: 2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe), 2015-09-01, S. 1-8KonferenzZugriff:
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In: 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2013-09-01, S. 253-261KonferenzZugriff:
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In: 2012 7th International Conference on Integrated Power Electronics Systems (CIPS), 2012-03-01, S. 1-6KonferenzZugriff:
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In: HITEN 99. Third European Conference on High Temperature Electronics. (IEEE Cat. No.99EX372), 1999, S. 65-65KonferenzZugriff:
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In: 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2018-06-01, S. 8-13KonferenzZugriff:
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In: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2017-06-01, S. 157-161KonferenzZugriff:
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In: 2013 Eurpoean Microelectronics Packaging Conference (EMPC), 2013-09-01, S. 1-6KonferenzZugriff:
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In: IEEE Transactions on Power Electronics, Jg. 22 (2007-03-01), Heft 2, S. 384-391Online academicJournalZugriff:
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In: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 2014-09-01, S. 1-6KonferenzZugriff:
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In: 2014 16th European Conference on Power Electronics and Applications, 2014-08-01, S. 1-10KonferenzZugriff:
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In: 2012 7th International Conference on Integrated Power Electronics Systems (CIPS), 2012-03-01, S. 1-6KonferenzZugriff:
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In: 2012 7th International Conference on Integrated Power Electronics Systems (CIPS), 2012-03-01, S. 1-6KonferenzZugriff:
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In: 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), Jg. 6 (2004), S. 4183-4187KonferenzZugriff:
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In: 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), Jg. 6 (2004), S. 4171-4177KonferenzZugriff:
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In: 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), Jg. 4 (2004), S. 2593-2598KonferenzZugriff:
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In: Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2001, S. 27-34KonferenzZugriff:
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In: IEEE Transactions on Device and Materials Reliability, Jg. 16 (2016-09-01), Heft 3, S. 345-345Online academicJournalZugriff:
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In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020-09-15, S. 1-7KonferenzZugriff:
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In: 2022 International Conference on Electronics Packaging (ICEP), 2022-05-11, S. 151-152KonferenzZugriff:
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In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020-06-01, S. 1592-1600KonferenzZugriff: