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Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- assemblage brasage tendre 577 Treffer
- junta soldada 557 Treffer
- soldered joint 557 Treffer
- electronique des semiconducteurs. microelectronique. optoelectronique. dispositifs a l'etat solide 540 Treffer
- semiconductor electronics. microelectronics. optoelectronics. solid state devices 540 Treffer
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45 weitere Werte:
- electronic packaging 506 Treffer
- packaging electronico 506 Treffer
- packaging electronique 506 Treffer
- integrated circuits 483 Treffer
- circuits integres 482 Treffer
- conception. technologies. analyse fonctionnement. essais 478 Treffer
- design. technologies. operation analysis. testing 478 Treffer
- assemblage circuit integre 470 Treffer
- integrated circuit bonding 470 Treffer
- reliability 320 Treffer
- fiabilite 317 Treffer
- fiabilidad 313 Treffer
- appareillage electronique et fabrication. composants passifs, circuits imprimes, connectique 233 Treffer
- electronic equipment and fabrication. passive components, printed wiring boards, connectics 233 Treffer
- circuit integre 205 Treffer
- integrated circuit 205 Treffer
- circuito integrado 204 Treffer
- interconexion 174 Treffer
- interconnection 174 Treffer
- interconnexion 174 Treffer
- physics 156 Treffer
- physique 156 Treffer
- evaluacion prestacion 142 Treffer
- evaluation performance 142 Treffer
- performance evaluation 142 Treffer
- ciclo termico 136 Treffer
- cycle thermique 136 Treffer
- essais, mesure, bruit et fiabilite 136 Treffer
- testing, measurement, noise and reliability 136 Treffer
- thermal cycle 136 Treffer
- defaillance 135 Treffer
- failures 135 Treffer
- fallo 133 Treffer
- carte electronique 128 Treffer
- printed circuit board 128 Treffer
- tarjeta electronica 128 Treffer
- contact bosse 123 Treffer
- solder bump 123 Treffer
- contacto con bollos 120 Treffer
- finite element method 116 Treffer
- methode element fini 116 Treffer
- metodo elemento finito 115 Treffer
- circuit imprime 112 Treffer
- circuito imprimido 112 Treffer
- printed circuit 112 Treffer
Verlag
- institute of electrical and electronics engineers 189 Treffer
- ieee 125 Treffer
- elsevier 105 Treffer
- spie 72 Treffer
- springer 49 Treffer
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28 weitere Werte:
- emerald 30 Treffer
- mcb university press 16 Treffer
- international microelectronics and packaging society 13 Treffer
- elsevier science 10 Treffer
- imaps 9 Treffer
- international microelectronics and packaging society imaps 8 Treffer
- institute of physics 4 Treffer
- institution of electrical engineers 3 Treffer
- [tima] 2 Treffer
- institution of engineering and technology 2 Treffer
- laboratoire tima 2 Treffer
- mechanical engineering publications 2 Treffer
- nec creative 2 Treffer
- oxford university press 2 Treffer
- brill 1 Treffer
- electrochemical society 1 Treffer
- hyomen gijutsu kyokai 1 Treffer
- ieee computer society 1 Treffer
- inderscience publishers 1 Treffer
- intitute of electrical and electronics engineers 1 Treffer
- kluwer academic publishers 1 Treffer
- penton 1 Treffer
- sage 1 Treffer
- same 1 Treffer
- taylor & francis 1 Treffer
- techniques de l'ingenieur 1 Treffer
- tima 1 Treffer
- wiley 1 Treffer
Publikation
- microelectronics and reliability 90 Treffer
- spie proceedings series 76 Treffer
- journal of electronic materials 72 Treffer
- ieee transactions on advanced packaging 63 Treffer
- proceedings - electronic components conference 62 Treffer
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45 weitere Werte:
- 54th electronic components & technology conference (las vegas nv, 1-4 june 2004) 35 Treffer
- ieee transactions on components, packaging, and manufacturing technology (2011. print) 30 Treffer
- soldering & surface mount technology 30 Treffer
- 52nd electronic components & technology conference (san diego ca, 28-31 may 2002) 27 Treffer
- ieee transactions on electronics packaging manufacturing 24 Treffer
- imaps : international symposium on microelectronics (denver co, 4-6 september 2002) 21 Treffer
- imaps 2000 : international symposium on microelectronics (boston ma, 20-22 september 2000) 21 Treffer
- itherm 2004 (ninth intersociety conference on thermal and thermomechanical phenomena in electronic systems) 20 Treffer
- microelectronics (baltimore md, 9-11 october 2001) 18 Treffer
- journal of materials science. materials in electronics 17 Treffer
- microelectronics international 16 Treffer
- ieee/cpmt international electronics manufacturing technology symposium 15 Treffer
- iemt 2002 : international electronics manufacturing technology symposium (san jose ca, 17-18 july 2002) 15 Treffer
- journal of microelectronics and electronic packaging 13 Treffer
- microelectronic engineering 12 Treffer
- 29th international electronics manufacturing technology symposium (san jose ca ca, 14-16 july 2004) 9 Treffer
- the international journal of microcircuits and electronic packaging 8 Treffer
- pb-free solders and materials for emerging interconnect and packaging technologies 6 Treffer
- 2002 international conference on advanced packaging and systems (reno nv, 10-13 march 2002) 5 Treffer
- ieee transactions on microwave theory and techniques 5 Treffer
- journal of alloys and compounds 5 Treffer
- electronics components and technology conference 4 Treffer
- ieee journal of solid-state circuits 4 Treffer
- ieee microwave and wireless components letters 4 Treffer
- microelectronics (boston ma, 18-20 november 2003) 4 Treffer
- microelectronics journal 4 Treffer
- special issue on lead-free solders and processing issues relevant to microelectronic packaging 4 Treffer
- twentieth annual ieee semiconductor thermal measurement and management symposium (semi-therm 2004, march 9-11, 2004, san jose ca, usa) 4 Treffer
- annual ieee semiconductor thermal measurement and management symposium 3 Treffer
- electronics letters 3 Treffer
- lead-free solders and materials issues in microelectronic packaging 3 Treffer
- semi-therm : semiconductor thermal measurement and management symposium (san jose ca, 12-14 march 2002) 3 Treffer
- 10th international workshop on thermal investigations of ics and systems (sophia antipolis, 29 september - 1 october 2004) 2 Treffer
- 16th european symposium on reliability of electron devices, failure physics and analysis (esref 2005), arcachon, france, october 10-14, 2005 2 Treffer
- 17th european symposium on reliability of electron devices, failure physics and analysis (esref 2006), wuppertal, germany, 3-6 october 2006 2 Treffer
- 2004 4th ieee international conference on polymers and adhesives in microelectronics and photonics (portland or, 12-15 september 2004) 2 Treffer
- 3-d integration technologies 2 Treffer
- 9th international symposium on advanced packaging materials (processes, properties and interfaces) 2 Treffer
- ceramic interconnect technology : the next generation (denver co, 7-9 april 2003) 2 Treffer
- ieee electron device letters 2 Treffer
- ieee transactions on very large scale integration (vlsi) systems 2 Treffer
- ieice transactions on electronics 2 Treffer
- iet microwaves, antennas & propagation (print) 2 Treffer
- international workshop on thermal investigation of ics and systems (therminic, aix-en-provence, france, 24-26 september 2003) 2 Treffer
- journal of micromechanics and microengineering (print) 2 Treffer
Sprache
Geographischer Bezug
655 Treffer
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In: Microelectronics and reliability, Jg. 54 (2014), Heft 1, S. 226-232academicJournalZugriff:
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In: IEEE transactions on electronics packaging manufacturing, Jg. 28 (2005), Heft 4, S. 328-337Online KonferenzZugriff:
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In: Proceedings of the ninth european workshop on materials for advanced metallization 2005, 6-9 March 2005, Dresden, Germany, Jg. 82 (2005), Heft 3-4, S. 569-574KonferenzZugriff:
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In: 16th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2005), Arcachon, France, October 10-14, Jg. 45 (2005), Heft 9-11, S. 1652-1657KonferenzZugriff:
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In: Microelectronics and reliability, Jg. 47 (2007), Heft 2-3, S. 205-214KonferenzZugriff:
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In: 2004 4th IEEE international conference on polymers and adhesives in microelectronics and photonics (Portland OR, 12-15 September 2004), 2004, S. 163-170KonferenzZugriff:
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In: 9th international symposium on advanced packaging materials (processes, properties and interfaces), 2004, S. 38-44KonferenzZugriff:
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In: 29th international electronics manufacturing technology symposium (San Jose CA CA, 14-16 July 2004), 2004, S. 345-354KonferenzZugriff:
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In: 9th international symposium on advanced packaging materials (processes, properties and interfaces), 2004, S. 31-37KonferenzZugriff:
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Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packagesIn: Eurosime special section package and solder joint reliability analysed by fem simulation and experiments, Jg. 44 (2004), Heft 12, S. 1957-1965KonferenzZugriff:
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In: Journal of electronic materials, Jg. 43 (2014), Heft 9, S. 3341-3350Online academicJournalZugriff:
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In: Journal of electronic materials, Jg. 43 (2014), Heft 11, S. 4229-4240Online academicJournalZugriff:
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In: Proceedings of the ninth european workshop on materials for advanced metallization 2005, 6-9 March 2005, Dresden, Germany, Jg. 82 (2005), Heft 3-4, S. 561-568KonferenzZugriff:
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In: IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002), 2002, S. 691-696KonferenzZugriff:
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In: IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002), 2002, S. 524-532KonferenzZugriff:
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In: 52nd electronic components & technology conference (San Diego CA, 28-31 May 2002), 2002, S. 1291-1296KonferenzZugriff:
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In: 52nd electronic components & technology conference (San Diego CA, 28-31 May 2002), 2002, S. 1114-1118KonferenzZugriff:
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In: IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002), 2002, S. 10-15KonferenzZugriff:
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In: 52nd electronic components & technology conference (San Diego CA, 28-31 May 2002), 2002, S. 1753-1756KonferenzZugriff:
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In: 52nd electronic components & technology conference (San Diego CA, 28-31 May 2002), 2002, S. 1001-1006KonferenzZugriff: