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Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- components, circuits, devices and systems 10 Treffer
- engineered materials, dielectrics and plasmas 7 Treffer
- power, energy and industry applications 5 Treffer
- aging 3 Treffer
- dielectrics 3 Treffer
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45 weitere Werte:
- intermetallic 3 Treffer
- microstructure 3 Treffer
- testing 3 Treffer
- tin 3 Treffer
- breakdown voltage 2 Treffer
- circuit breakers 2 Treffer
- circuit faults 2 Treffer
- contacts 2 Treffer
- copper 2 Treffer
- dielectrics and electrical insulation 2 Treffer
- electric resistance 2 Treffer
- environmentally friendly manufacturing techniques 2 Treffer
- failure analysis 2 Treffer
- fields, waves and electromagnetics 2 Treffer
- films 2 Treffer
- fluid flow 2 Treffer
- gold 2 Treffer
- lead 2 Treffer
- packaging 2 Treffer
- photonics and electrooptics 2 Treffer
- silicon 2 Treffer
- thermal force 2 Treffer
- thermal resistance 2 Treffer
- transient analysis 2 Treffer
- wafer bonding 2 Treffer
- wafer scale integration 2 Treffer
- accelerated aging 1 Treffer
- aerospace 1 Treffer
- anisotropic magnetoresistance 1 Treffer
- argon 1 Treffer
- assembly 1 Treffer
- atomic force microscopy 1 Treffer
- bioengineering 1 Treffer
- bonding 1 Treffer
- ceramics 1 Treffer
- chemicals 1 Treffer
- cleaning 1 Treffer
- coils 1 Treffer
- communication, networking and broadcast technologies 1 Treffer
- computing and processing 1 Treffer
- conductive adhesives 1 Treffer
- control systems 1 Treffer
- creep 1 Treffer
- electronics packaging 1 Treffer
- engineering profession 1 Treffer
Publikation
- 2001 proceedings. 51st electronic components and technology conference (cat. no.01ch37220), electronic components and technology conference, 2001. proceedings., 51st, electronic components and technology 1 Treffer
- 2007 electrical insulation conference and electrical manufacturing expo, electrical insulation conference and electrical manufacturing expo, 2007 1 Treffer
- 2009 international conference on electronic packaging technology & high density packaging, electronic packaging technology & high density packaging, 2009. icept-hdp '09. international conference on 1 Treffer
- 2010 proceedings 60th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2010 proceedings 60th 1 Treffer
- 2016 11th international microsystems, packaging, assembly and circuits technology conference (impact), microsystems, packaging, assembly and circuits technology conference (impact), 2016 11th international 1 Treffer
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7 weitere Werte:
- 2023 ieee 24th international conference of young professionals in electron devices and materials (edm), young professionals in electron devices and materials (edm), 2023 ieee 24th international conference of 1 Treffer
- advances in electronic materials and packaging 2001 (cat. no.01ex506), electronic materials and packaging, 2001. emap 2001. advances in, electronics materials and packaging 1 Treffer
- ieee transactions on dielectrics and electrical insulation, dielectrics and electrical insulation, ieee transactions on, ieee trans. dielect. electr. insul. 1 Treffer
- ieee transactions on electronics packaging manufacturing, electronics packaging manufacturing, ieee transactions on, ieee trans. electron. packag. manufact. 1 Treffer
- ieee transactions on power delivery, power delivery, ieee transactions on, ieee trans. power delivery 1 Treffer
- proceedings of the sixth ieee cpmt conference on high density microsystem design and packaging and component failure analysis (hdp '04), high density microsystem design and packaging and component failure analysis, 2004. hdp '04. proceeding of the sixth ieee cpmt conference on, high density microsystem design and packaging and component failure analysis 1 Treffer
- proceedings. international conference on power system technology, power system technology, 2002. proceedings. powercon 2002. international conference on, power systems technology 1 Treffer
12 Treffer
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In: 2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM), 2023-06-29, S. 240-243KonferenzZugriff:
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In: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001, S. 478-485KonferenzZugriff:
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In: IEEE Transactions on Electronics Packaging Manufacturing, Jg. 25 (2002-07-01), Heft 3, S. 185-192Online academicJournalZugriff:
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In: 2007 Electrical Insulation Conference and Electrical Manufacturing Expo, 2007-10-01, S. 114KonferenzZugriff:
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In: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016-10-01, S. 389-392KonferenzZugriff:
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In: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010-06-01, S. 1964-1967KonferenzZugriff:
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In: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04), 2004, S. 47-51KonferenzZugriff:
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In: Proceedings. International Conference on Power System Technology, Jg. 3 (2002), S. 1624-1629KonferenzZugriff:
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In: IEEE Transactions on Power Delivery, Jg. 20 (2005-07-01), Heft 3, S. 1897-1903Online academicJournalZugriff:
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In: IEEE Transactions on Dielectrics and Electrical Insulation, Jg. 12 (2005-06-01), Heft 3, S. 455-468Online academicJournalZugriff:
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In: Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2001, S. 193-195KonferenzZugriff:
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In: 2009 International Conference on Electronic Packaging Technology & High Density, 2009-08-01, S. 485KonferenzZugriff: