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Weniger Treffer
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- heat sink 3 Treffer
- power module 3 Treffer
- business 2 Treffer
- business.industry 2 Treffer
- composite material 2 Treffer
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34 weitere Werte:
- delamination 2 Treffer
- die (integrated circuit) 2 Treffer
- heat transfer 2 Treffer
- mechanical engineering 2 Treffer
- thermal conductivity 2 Treffer
- thermal grease 2 Treffer
- [spi.tron]engineering sciences [physics]/electronics 1 Treffer
- atomic and molecular physics, and optics 1 Treffer
- ceramic 1 Treffer
- ceramique 1 Treffer
- chemistry 1 Treffer
- chemistry.chemical_element 1 Treffer
- condensed matter physics 1 Treffer
- copper 1 Treffer
- dimple 1 Treffer
- electrical and electronic engineering 1 Treffer
- electronic, optical and magnetic materials 1 Treffer
- electronique 1 Treffer
- fiabilite 1 Treffer
- fluid transport 1 Treffer
- intermetallic 1 Treffer
- joint (geology) 1 Treffer
- puissance 1 Treffer
- reliability (semiconductor) 1 Treffer
- safety, risk, reliability and quality 1 Treffer
- semiconductor 1 Treffer
- soldering 1 Treffer
- structural engineering 1 Treffer
- substrate (electronics) 1 Treffer
- surfaces, coatings and films 1 Treffer
- system testing 1 Treffer
- thermal contact 1 Treffer
- visual_art 1 Treffer
- visual_art.visual_art_medium 1 Treffer
Verlag
Publikation
- 2018 17th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm) 1 Treffer
- 2018 international conference on electronics packaging and imaps all asia conference (icep-iaac) 1 Treffer
- 2019 20th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime) 1 Treffer
- microelectronics reliability 1 Treffer
Sprache
4 Treffer
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In: Microelectronics Reliability, Jg. 46 (2006-09-01), S. 1766-1771Online unknownZugriff:
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In: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019-03-01Online unknownZugriff:
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In: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018-05-01Online unknownZugriff:
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In: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018-04-01Online unknownZugriff: