Suchergebnisse
UB Katalog
Artikel & mehr
Suchmaske
Suchergebnisse einschränken oder erweitern
Aktive Suchfilter
Weniger Treffer
Gefunden in
Art der Quelle
Schlagwort
- components, circuits, devices and systems 8 Treffer
- fields, waves and electromagnetics 8 Treffer
- bioengineering 5 Treffer
- communication, networking and broadcast technologies 5 Treffer
- coplanar waveguides 5 Treffer
-
45 weitere Werte:
- photonics and electrooptics 5 Treffer
- loss measurement 4 Treffer
- computing and processing 3 Treffer
- engineered materials, dielectrics and plasmas 3 Treffer
- micromechanical devices 3 Treffer
- power, energy and industry applications 3 Treffer
- metals 2 Treffer
- rf mems 2 Treffer
- robotics and control systems 2 Treffer
- wires 2 Treffer
- aerospace 1 Treffer
- aluminum nitride 1 Treffer
- antenna measurements 1 Treffer
- automatic 1 Treffer
- bonding 1 Treffer
- bonding wires 1 Treffer
- bow-tie antenna 1 Treffer
- class-e 1 Treffer
- complex dielectric permittivity 1 Treffer
- contacts 1 Treffer
- coplanar waveguide 1 Treffer
- cpw 1 Treffer
- data models 1 Treffer
- fabrication 1 Treffer
- gain measurement 1 Treffer
- heating systems 1 Treffer
- high-resistivity silicon 1 Treffer
- iii-v semiconductor materials 1 Treffer
- insertion loss 1 Treffer
- integrated circuit modeling 1 Treffer
- lead 1 Treffer
- liquids 1 Treffer
- low temperature co-fired ceramic 1 Treffer
- mems 1 Treffer
- micro machining 1 Treffer
- microfluidics 1 Treffer
- microswitches 1 Treffer
- microwave measurement 1 Treffer
- microwave sensor 1 Treffer
- mmics 1 Treffer
- optimization 1 Treffer
- package 1 Treffer
- parameter extraction 1 Treffer
- parametric modeling 1 Treffer
- permittivity 1 Treffer
Verlag
Publikation
- ieee microwave and wireless components letters, microwave and wireless components letters, ieee, ieee microw. wireless compon. lett. 2 Treffer
- 2012 7th international microsystems, packaging, assembly and circuits technology conference (impact), microsystems, packaging, assembly and circuits technology conference (impact), 2012 7th international 1 Treffer
- 2013 ieee bipolar/bicmos circuits and technology meeting (bctm), bipolar/bicmos circuits and technology meeting (bctm), 2013 ieee 1 Treffer
- 2013 ieee international conference on microwaves, communications, antennas and electronic systems (comcas 2013), microwaves, communications, antennas and electronics systems (comcas), 2013 ieee international conference on 1 Treffer
- 2017 conference on emerging devices and smart systems (icedss), emerging devices and smart systems (icedss), 2017 conference on 1 Treffer
-
5 weitere Werte:
- 2017 international conference on electron devices and solid-state circuits (edssc), electron devices and solid-state circuits (edssc), 2017 international conference on 1 Treffer
- 2017 international conference on electronics packaging (icep), electronics packaging (icep), 2017 international conference on 1 Treffer
- 2019 ieee 32nd international conference on micro electro mechanical systems (mems), micro electro mechanical systems (mems), 2019 ieee 32nd international conference on 1 Treffer
- 2022 23rd international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2022 23rd international conference on 1 Treffer
- 2023 5th novel intelligent and leading emerging sciences conference (niles), novel intelligent and leading emerging sciences conference (niles), 2023 5th 1 Treffer
11 Treffer
-
In: 2023 5th Novel Intelligent and Leading Emerging Sciences Conference (NILES), 2023-10-21, S. 416-419KonferenzZugriff:
-
In: IEEE Microwave and Wireless Components Letters, Jg. 25 (2015-09-01), Heft 9, S. 585-587Online academicJournalZugriff:
-
In: 2017 International Conference on Electronics Packaging (ICEP), 2017-04-01, S. 237-238KonferenzZugriff:
-
In: 2017 Conference on Emerging Devices and Smart Systems (ICEDSS), 2017-03-01, S. 133-136KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-4KonferenzZugriff:
-
In: 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS), 2019, S. 891-894KonferenzZugriff:
-
In: 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS 2013), 2013-10-01, S. 1-5KonferenzZugriff:
-
In: 2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013-09-01, S. 77-80KonferenzZugriff:
-
In: 2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC), 2017-10-01, S. 1-2KonferenzZugriff:
-
In: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012-10-01, S. 373-379KonferenzZugriff:
-
In: IEEE Microwave and Wireless Components Letters, Jg. 24 (2014-07-01), Heft 7, S. 490-492Online academicJournalZugriff: