A copper electroplating formula for BVHs and THs filling at one process.
In: Circuit World, Jg. 42 (2016-07-01), Heft 3, S. 141-151
Online
academicJournal
Zugriff:
Titel: |
A copper electroplating formula for BVHs and THs filling at one process.
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Autor/in / Beteiligte Person: | Liu, Jia ; Chen, Jida ; Zhang, Zhu ; Yang, Jiali ; He, Wei ; Chen, Shijin |
Link: | |
Zeitschrift: | Circuit World, Jg. 42 (2016-07-01), Heft 3, S. 141-151 |
Veröffentlichung: | 2016 |
Medientyp: | academicJournal |
ISSN: | 0305-6120 (print) |
DOI: | 10.1108/CW-10-2015-0049 |
Sonstiges: |
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