Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder.
In: Journal of Electronic Materials, Jg. 49 (2020-04-01), Heft 4, S. 2660-2668
Online
academicJournal
Zugriff:
Titel: |
Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder.
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Autor/in / Beteiligte Person: | Fan, Jianglei ; Zhai, Hengtao ; Liu, Zhanyun ; Wang, Xiao ; Zhou, Xiangkui ; Wang, Yan ; Li, Ying ; Gao, Hongxia ; Liu, Jianxiu |
Link: | |
Zeitschrift: | Journal of Electronic Materials, Jg. 49 (2020-04-01), Heft 4, S. 2660-2668 |
Veröffentlichung: | 2020 |
Medientyp: | academicJournal |
ISSN: | 0361-5235 (print) |
DOI: | 10.1007/s11664-020-07960-y |
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