Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation.
In: IEEE Transactions on Semiconductor Manufacturing, Jg. 36 (2023-11-01), Heft 4, S. 537-542
Online
academicJournal
Zugriff:
Titel: |
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation.
|
---|---|
Autor/in / Beteiligte Person: | Baderot, Julien ; Garrais, Solange ; Martinez, Sergio ; Foucher, Johann ; Eto, Ryuji ; Tanida, Kazumasa ; Yasui, Takatoshi ; Tanaka, Tomoya |
Link: | |
Zeitschrift: | IEEE Transactions on Semiconductor Manufacturing, Jg. 36 (2023-11-01), Heft 4, S. 537-542 |
Veröffentlichung: | 2023 |
Medientyp: | academicJournal |
ISSN: | 0894-6507 (print) |
DOI: | 10.1109/TSM.2023.3281135 |
Sonstiges: |
|