Melamine foam-supported 3D interconnected boron nitride nanosheets network encapsulated in epoxy to achieve significant thermal conductivity enhancement at an ultralow filler loading.
In: Chemical Engineering Journal, Jg. 348 (2018-09-15), S. 723-731
academicJournal
Zugriff:
Realizing high-efficiency thermal conductivity enhancement at low filler loading has a great significance for thermally conductive composite. Herein, three-dimensional (3D) boron nitride nanosheets (BNNSs) wrapped melamine foams (MF@BNNS) were first fabricated by repeated layer-by-layer (L-B-L) assembly using melamine skeleton as substrate and BNNSs as building blocks. The resultant MF@BNNS scaffold with order and interconnected BNNS layer, as a thermally conductive network, was further infiltrated with epoxy resin. As a consequence, a relatively high thermal conductivity of 0.6 W m −1 K −1 was achieved at an ultralow BNNS loading of ∼1.1 vol%, which is equivalent to a thermal conductivity enhancement of 233% compared to epoxy resin. Besides, the obtained epoxy composite also possesses a good mechanical property and excellent electrical insulativity. This method can be further extended to construct 3D filler network of other 2D layered materials on the melamine foam for high-performance composite. [ABSTRACT FROM AUTHOR]
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Melamine foam-supported 3D interconnected boron nitride nanosheets network encapsulated in epoxy to achieve significant thermal conductivity enhancement at an ultralow filler loading.
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Autor/in / Beteiligte Person: | Wang, Xiongwei ; Wu, Peiyi |
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Zeitschrift: | Chemical Engineering Journal, Jg. 348 (2018-09-15), S. 723-731 |
Veröffentlichung: | 2018 |
Medientyp: | academicJournal |
ISSN: | 1385-8947 (print) |
DOI: | 10.1016/j.cej.2018.04.196 |
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