Study of Some Parameter Effects on Warpage and Bump-Joint Stresses of COG Packages.
In: IEEE Transactions on Advanced Packaging, Jg. 29 (2006-08-01), Heft 3, S. 587-598
Online
academicJournal
Zugriff:
Titel: |
Study of Some Parameter Effects on Warpage and Bump-Joint Stresses of COG Packages.
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Autor/in / Beteiligte Person: | Tsai, Ming-Yi ; Wu, Chung-Yen ; Huang, Chen-TYu ; Cheng, Wen-Chen ; Yang, Sheng-Shu |
Link: | |
Zeitschrift: | IEEE Transactions on Advanced Packaging, Jg. 29 (2006-08-01), Heft 3, S. 587-598 |
Veröffentlichung: | 2006 |
Medientyp: | academicJournal |
ISSN: | 1521-3323 (print) |
DOI: | 10.1109/TADVP.2006.875094 |
Sonstiges: |
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