Performance Comparison of Flip-Chip-Assembled 5-GHz 0.18-\mum CMOS Power Amplifiers on Different Packaging Substrates.
In: IEEE Transactions on Components, Packaging & Manufacturing Technology, Jg. 3 (2013-12-01), Heft 12, S. 2014-2021
Online
academicJournal
Zugriff:
Titel: |
Performance Comparison of Flip-Chip-Assembled 5-GHz 0.18-\mum CMOS Power Amplifiers on Different Packaging Substrates.
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Autor/in / Beteiligte Person: | Kuo, Che-Chung ; Hsu, Yao-Wen ; Huang, Wei-Chao ; Wang, Huei ; Lu, Hsin-Chia |
Link: | |
Zeitschrift: | IEEE Transactions on Components, Packaging & Manufacturing Technology, Jg. 3 (2013-12-01), Heft 12, S. 2014-2021 |
Veröffentlichung: | 2013 |
Medientyp: | academicJournal |
ISSN: | 2156-3950 (print) |
DOI: | 10.1109/TCPMT.2013.2282295 |
Sonstiges: |
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