Sonstiges: |
- Nachgewiesen in: MEDLINE
- Sprachen: English
- Publication Type: Journal Article
- Language: English
- [Small] 2024 Mar; Vol. 20 (13), pp. e2306871. <i>Date of Electronic Publication: </i>2023 Nov 15.
- References: L. Brunet, P. Batude, C. Fenouillet‐Beranger, P. Besombes, L. Hortemel, F. Ponthenier, B. Previtali, C. Tabone, A. Royer, C. Agraffeil, C. Euvrard‐Colnat, A. Seignard, C. Morales, F. Fournel, L. Benaissa, T. Signamarcheix, P. Besson, M. Jourdan, R. Kachtouli, V. Benevent, J. M. Hartmann, C. Comboroure, N. Allouti, N. Posseme, C. Vizioz, C. Arvet, S. Barnola, S. Kerdiles, L. Baud, L. Pasini, et al., presented at 2016 IEEE Symp. on VLSI Technology, IEEE, New York 2016, 14. ; T. S. Böscke, J. Müller, D. Bräuhaus, U. Schröder, U. Böttger, Appl. Phys. Lett. 2011, 99, 102903. ; A. I. Khan, A. Keshavarzi, S. Datta, Nat. Electron. 2020, 3, 588. ; I.‐J. Kim, J.‐S. Lee, Adv. Mater. 2023, 35, 2206864. ; M.‐K. Kim, I.‐J. Kim, J.‐S. Lee, Sci. Adv. 2021, 7, eabe1341. ; I.‐J. Kim, M.‐K. Kim, J.‐S. Lee, Appl. Phys. Lett. 2022, 121, 042901. ; S. S. Cheema, N. Shanker, C.‐H. Hsu, A. Datar, J. Bae, D. Kwon, S. Salahuddin, Adv. Electron. Mater. 2022, 8, 2100499. ; I. J. Kim, M. K. Kim, J. S. Lee, IEEE Electron Device Lett. 2022, 44, 249. ; Z. Lin, M. Si, P. D. Ye, presented at 2022 IEEE Symp. on VLSI Technol. Circuits, IEEE, New York 2022, 12. ; M. Jerry, P. Y. Chen, J. Zhang, P. Sharma, K. Ni, S. Yu, S. Datta, presented at 2017 IEEE Int. Electron Devices Meeting (IEDM), IEEE, New York 2017, 2. ; M. Seo, M. H. Kang, S. B. Jeon, H. Bae, J. Hur, B. C. Jang, S. Yun, S. Cho, W. K. Kim, M. S. Kim, K. M. Hwang, S. Hong, S. Y. Choi, Y. K. Choi, IEEE Electron Device Lett. 2018, 39, 1445. ; M.‐K. Kim, J.‐S. Lee, Nano Lett. 2019, 19, 2044. ; M.‐K. Kim, J.‐S. Lee, Adv. Mater. 2020, 32, 1907826. ; J. Woo, presented at 2021 IEEE Int. Symp. on Circuits and Systems (ISCAS), IEEE, New York 2021, 22. ; M.‐K. Kim, I.‐J. Kim, J.‐S. Lee, Sci. Adv. 2022, 8, eabm8537. ; P. Polakowski, S. Riedel, W. Weinreich, M. Rudolf, J. Sundqvist, K. Seidel, J. Muller, presented at 2014 IEEE 6th Int. Memory Workshop (IMW), IEEE, New York 2014, p. 18. ; F. Mo, Y. Tagawa, C. Jin, M. Ahn, T. Saraya, T. Hiramoto, M. Kobayashi, IEEE J. Electron Devices Soc. 2020, 8, 717. ; P. Batude, B. Sklenard, C. Fenouillet‐Beranger, B. Previtali, C. Tabone, O. Rozeau, O. Billoint, O. Turkyilmaz, H. Sarhan, S. Thuries, G. Cibrario, L. Brunet, F. Deprat, J. E. Michallet, F. Clermidy, M. Vinet, presented at IEEE Int. Interconnect Technology Conf., IEEE, New York 2014, 20. ; A. Thean, S. H. Tsai, C. K. Chen, M. Sivan, B. Tang, S. Hooda, Z. Fang, J. Pan, J. Leong, H. Veluri, E. Zamburg, presented at 2022 Int. Electron Devices Meeting (IEDM), IEEE, New York 2022, 3. ; G. Kim, H. Shin, T. Eom, M. Jung, T. Kim, S. Lee, M. Kim, Y. Jeong, J.‐S. Kim, K.‐J. Nam, B. J. Kuh, S. Jeon, presented at 2022 IEEE Int. Electron Devices Meeting (IEDM), IEEE, New York 2022, 13. ; S.‐Y. Kim, J. K. Park, W. S. Hwang, S.‐J. Lee, K.‐H. Lee, S. H. Pyi, B. J. Cho, J. Nanosci. Nanotechnol. 2016, 16, 5044. ; M. Hoffmann, U. Schroeder, T. Schenk, T. Shimizu, H. Funakubo, O. Sakata, D. Pohl, M. Drescher, C. Adelmann, R. Materlik, A. Kersch, T. Mikolajick, J. Appl. Phys. 2015, 118, 072006. ; C.‐K. Lee, E. Cho, H.‐S. Lee, C. S. Hwang, S. Han, Phys. Rev. B 2008, 78, 012102. ; K.‐Y. Chen, K.‐L. Chu, P.‐H. Chen, Y.‐H. Wu, RSC Adv. 2016, 6, 74445. ; Y. Choi, J. Shin, S. Moon, J. Min, C. Han, C. Shin, Nanotechnology 2023, 34, 185203. ; Y. Goh, S. Jeon, Nanotechnology 2018, 29, 335201. ; R. Cao, Y. Wang, S. Zhao, Y. Yang, X. Zhao, W. Wang, X. Zhang, H. Lv, Q. Liu, M. Liu, IEEE Electron Device Lett. 2018, 39, 1207. ; M. Hoffmann, U. Schroeder, T. Schenk, T. Shimizu, H. Funakubo, O. Sakata, D. Pohl, M. Drescher, C. Adelmann, R. Materlik, A. Kersch, T. Mikolajick, J. Appl. Phys. 2015, 118. ; J. Wang, D. Wang, Q. Li, A. Zhang, D. Gao, M. Guo, J. Feng, Z. Fan, D. Chen, M. Qin, M. Zeng, X. Gao, G. Zhou, X. Lu, J. M. Liu, IEEE Electron Device Lett. 2019, 40, 1937. ; M.‐K. Kim, I.‐J. Kim, J.‐S. Lee, ACS Omega 2023, 8, 18180. ; T. Mittmann, M. Materano, S. C. Chang, I. Karpov, T. Mikolajick, U. Schroeder, 2020 IEEE Int. Electron Devices Meeting (IEDM), IEEE, New York 2020, 12. ; R. Ichihara, S. Fujii, M. Yamaguchi, Y. Yoshimura, Y. Mitani, M. Saitoh, IEEE Trans. Electron Devices 2019, 66, 2165. ; W. Wei, W. Zhang, F. Wang, X. Ma, Q. Wang, P. Sang, X. Zhan, Y. Li, L. Tai, Q. Luo, H. Lv, J. Chen, presented at 2020 IEEE Int. Electron Devices Meeting (IEDM), IEEE, New York 2020. ; E. Yurchuk, J. Müller, J. Paul, T. Schlösser, D. Martin, R. Hoffmann, S. Müeller, S. Slesazeck, U. Schröeder, R. Boschke, R. v. Bentum, T. Mikolajick, IEEE Trans. Electron Devices 2014, 61, 3699. ; A. Ortiz‐Conde, F. J. Garcı́a Sánchez, J. J. Liou, A. Cerdeira, M. Estrada, Y. Yue, Microelectronics Reliability 2002, 42, 583. ; K. Nomura, H. Ohta, A. Takagi, T. Kamiya, M. Hirano, H. Hosono, Nature 2004, 432, 488. ; H. Yoo, I. S. Lee, S. Jung, S. M. Rho, B. H. Kang, H. J. Kim, Adv. Mater. 2021, 33, 2006091. ; B. Govoreanu, J. V. Houdt, IEEE Electron Device Lett. 2008, 29, 177. ; J.‐S. Lee, C.‐S. Kang, Y.‐C. Shin, C.‐H. Lee, K.‐T. Park, J.‐S. Sel, V. Kim, B.‐I. Choe, J.‐S. Sim, J. Choi, K. Kim, Jpn. J. Appl. Phys. 2006, 45, 3213.
- Grant Information: RS-2023-00258227 National Research Foundation of Korea; IO201215-08198-01 Samsung Electronics Company Ltd.
- Contributed Indexing: Keywords: data retention; ferroelectric materials; ferroelectric memories; ferroelectric thin‐film transistors; thermal stability
- Entry Date(s): Date Created: 20231115 Latest Revision: 20240328
- Update Code: 20240329
|