Low dielectric constant Parylene-F-like films for intermetal dielectric applications.
In: Applied Physics Letters, Jg. 74 (1999-01-25), Heft 4, S. 606-608
Online
academicJournal
Zugriff:
Examines the dielectric properties and thermal stability of thin polymer films that are suitable candidates for replacing silicon dioxide as the intermetal dielectric material in integrated circuits. Magnitude of electronic and ionic contributions to the dielectric constant; Plasma deposition of amorphous fluorinated carbon films from fluorocarbon gases.
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Low dielectric constant Parylene-F-like films for intermetal dielectric applications.
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Autor/in / Beteiligte Person: | Yanhaloglu, Bengi ; Aydini, Atilla ; Oye, Michael ; Aydi, Eray S. |
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Zeitschrift: | Applied Physics Letters, Jg. 74 (1999-01-25), Heft 4, S. 606-608 |
Veröffentlichung: | 1999 |
Medientyp: | academicJournal |
ISSN: | 0003-6951 (print) |
DOI: | 10.1063/1.123160 |
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