IC Fabrication Overview
Elsevier, 2005
Online
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Zugriff:
This chapter provides an introduction to integrated circuits (ICs). An integrated circuit (IC) is a miniaturized electronic device made by combining discrete electronic components into a single device. The IC may contain millions of transistors, diodes, resistors, capacitors, and other components integrated into a single chip. The chapter discusses how ICs are produced using the principal technology employed—complementary metal oxide semiconductor (CMOS). However, the complexity of this technology requires the support of other equally sophisticated technologies. Single crystal silicon is the material most commonly used in the fabrication of integrated circuits. Integrated circuits must be manufactured in a carefully controlled environment. ICs are made in cleanrooms, often called the fabrication area or fab for short. Process of layering is described that includes insulators (dielectrics), semiconductors, conductors, chemical mechanical polishing (CMP). Later, the patterning process is discussed that transfers the pattern from the reticle (or photomask) to the wafer using photolithographic technology. Dopants are introduced to alter the electrical conductivity of the doped region. They can be added to the wafer in a variety of ways. Currently, almost all of the doping of state-of-the-art ICs is done by implanting the dopant using a particle-beam machine called an ion implanter.
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IC Fabrication Overview
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Autor/in / Beteiligte Person: | Miller, Anne K. ; Heynes, Michael ; Yanda, Richard F. |
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Veröffentlichung: | Elsevier, 2005 |
Medientyp: | unknown |
DOI: | 10.1016/b978-075067760-8/50004-x |
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