A study on recovery of SiC from silicon wafer cutting slurry
In: Journal of Material Cycles and Waste Management, Jg. 20 (2017-02-18), S. 375-385
Online
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Zugriff:
The objective of this study is to recover SiC from silicon wafer cutting slurry using physical separation and acid/alkali purification processes. Hydrocyclone was used in the first-stage process to recover SiC and Si from silicon wafer cutting slurry. Through hydrocyclone separation, the SiC content and recovery of can reach 98 and 88%, respectively. In acid and alkali purification processes, the iron and silicon can be removed and further increase the SiC content up to 99.5%. From the test results obtained in this study, it is believed that the recycling and reutilization of SiC from silicon wafer cutting slurry can be highly feasible and economical.
Titel: |
A study on recovery of SiC from silicon wafer cutting slurry
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Autor/in / Beteiligte Person: | Cheng, Ta-Wui ; Ding, Yung-Chin ; Hsu, Chih-Wei ; Lee, Wei-Hao |
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Zeitschrift: | Journal of Material Cycles and Waste Management, Jg. 20 (2017-02-18), S. 375-385 |
Veröffentlichung: | Springer Science and Business Media LLC, 2017 |
Medientyp: | unknown |
ISSN: | 1611-8227 (print) ; 1438-4957 (print) |
DOI: | 10.1007/s10163-017-0591-7 |
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