Measurement-based extrinsic modeling of RF components
In: 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157), 2002-11-13
Online
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Zugriff:
An understanding of the high-frequency parasitic and packaging effects of passive surface-mounted devices (SMDs) is required for robust equivalent circuit modeling of the device. In this paper, we develop a CAD model for SMD inductors on a CPW layout, which incorporates the non-ideal behavior associated with frequency dispersion, board layout, component parasitics, and the device packaging. The equivalent circuit parameters are extracted in closed-form from an accurate measurement of the S-parameters of the board-mounted SMD inductor, without the necessity for cumbersome optimization procedures normally followed in RF circuit synthesis.
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Measurement-based extrinsic modeling of RF components
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Autor/in / Beteiligte Person: | Naishadham, Krishna |
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Zeitschrift: | 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157), 2002-11-13 |
Veröffentlichung: | IEEE, 2002 |
Medientyp: | unknown |
DOI: | 10.1109/mwsym.2001.967127 |
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