Experimental and Numerical Study of Paperboard Interface Properties

Laminated paperboard is widely used in packaging products. Interface delamination plays a crucial role in converting paperboard to a carton through the creasing and folding process. Thus, the aim of this study is to experimentally and numerically investigate the interface fracture behavior in pure crack opening mode (mode I) and sliding mode (mode II). Four experimental tests have been evaluated and compared to numerical simulation, namely, the z-directional tensile test (ZDT), double-notch shear test (DNS), double-cantilever beam test (DCB) and end-notched flexure test (ENF). It was shown that, for the paperboard specimens tested, the ZDT test was sufficient to fully characterize the mode I crack growth response. However, the DNS and ENF tests were required to determine the maximum shear stress and the fracture toughness of pure mode II, respectively. Further mixed-mode investigation would enable the analysis of paperboard delamination behavior during the creasing and folding process.