Design of Low-Loss Coplanar Transmission Lines Using Distributed Loading for Millimeter-Wave Power Divider/Combiner Applications in 0.18- <tex-math notation='LaTeX'>$\mu$ </tex-math> m CMOS Technology
In: IEEE Transactions on Microwave Theory and Techniques, Jg. 66 (2018-12-01), S. 5221-5229
Online
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Zugriff:
This paper presents a new type of a low-loss miniaturized coplanar-waveguide (CPW) transmission line (TL) by employing distributed loading, capacitors and inductors, in 0.18- $\mu \text{m}$ complementary metal–oxide–semiconductor (CMOS) technology. The capacitors are realized by vertical parallel plates made of vias, and a group of open stubs inserted to the signal line, whereas the inductors are realized by high impedance lines. Then, the proposed CPW-TL is employed to design a miniaturized millimeter wave ultra-wideband low-loss Wilkinson power divider/combiner (WPD/C). The proposed distributed loading results in reducing each WPD/C arm length by more than 50% without changing its characteristic impedance and insertion loss (IL). The design is fabricated in 0.18- $\mu \text{m}$ CMOS technology and tested. The measured results show a wideband performance from dc to 67 GHz with 1-dB IL and isolation greater than 15 dB from 36 to 67 GHz. In addition, the fabricated WPD/C achieves an excellent amplitude imbalance and phase imbalance of less than 0.16 dB and 0.45°, respectively. The core chip size is $336 \times 165\,\,\mu \text{m}^{2}$ , which is almost 32.8% compact compared to the recently proposed WPD in the same technology.
Titel: |
Design of Low-Loss Coplanar Transmission Lines Using Distributed Loading for Millimeter-Wave Power Divider/Combiner Applications in 0.18- <tex-math notation='LaTeX'>$\mu$ </tex-math> m CMOS Technology
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Autor/in / Beteiligte Person: | Anwer Sayed Abd El-Hameed ; Barakat, Adel ; Abdel-Rahman, Adel B. ; Allam, Ahmed ; Pokharel, Ramesh K. |
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Zeitschrift: | IEEE Transactions on Microwave Theory and Techniques, Jg. 66 (2018-12-01), S. 5221-5229 |
Veröffentlichung: | Institute of Electrical and Electronics Engineers (IEEE), 2018 |
Medientyp: | unknown |
ISSN: | 1557-9670 (print) ; 0018-9480 (print) |
DOI: | 10.1109/tmtt.2018.2873381 |
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