Modelling of magnetron sputtering process

Magnetron sputtering is a technique commonly used in modern industry for thin films deposition with an accurate control of the coating parameters. In the magnetron sputtering system the target material is sputtered off by plasma ions. The plasma is sustained by an electrical discharge and magnetically confined in the target vicinity. This results in much higher sputtering rate, lower operating pressure and lower discharge voltage compared to a glow discharge diode sputtering systems. The modelling of magnetron sputtering is essential for the design of new coating systems. It enables efficient, low-cost and time-saving optimisation of the system. In this paper information on modelling of magnetrons at the Department of physics, Faculty of Mechanical Engineering CTU is given. Our work consists of two parts. The magnetic field of a given magnet array is first modelled by the finite element method and the computed field is then used for simulation of the erosion process by a Monte-Carlo model. The results are compared with measured erosion tracks and the accuracy of the model is discussed.