Design and fabrication of low-microwave loss coplannar waveguide and precise V groove on silicon substrate for optoelectronic packaging
In: SPIE Proceedings, 2005-11-24
Online
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Zugriff:
Optoelectronic packaging has become a most important factor that influences the final performance and cost of the module. In this paper, low microwave loss coplanar waveguide(CPW) on high resistivity silicon(HRS) and precise V groove in silicon substrate were successfully fabricated. The microwave attenuation of the CPW made on HRS with the simple process is lower than 2 dB/cm in the frequency range of 0 similar to 26GHz, and V groove has the accuracy in micro level and smooth surface. These two techniques built a good foundation for high frequency packaging and passive coupling of the optoelectronic devices. Based on these two techniques, a simple high resistivity silicon substrate that integrated V groove and CPW for flip-chip packaging of lasers was completed. It set a good example for more complicate optoelectronic packaging.
Titel: |
Design and fabrication of low-microwave loss coplannar waveguide and precise V groove on silicon substrate for optoelectronic packaging
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Autor/in / Beteiligte Person: | Zhao, Lingjuan ; Zhu, Hongliang ; Wang, Wei ; Xie, Hongyun ; Yang, Hua ; Zhou, Fan |
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Zeitschrift: | SPIE Proceedings, 2005-11-24 |
Veröffentlichung: | SPIE, 2005 |
Medientyp: | unknown |
ISSN: | 0277-786X (print) |
DOI: | 10.1117/12.635519 |
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