High-Performance Inductors Using Capillary Based Fluidic Self-Assembly
In: Journal of Microelectromechanical Systems, Jg. 13 (2004-04-01), S. 300-309
Online
unknown
Zugriff:
In this paper, a batch microfabrication process is presented for creating high aspect ratio, micron-sized helical and toroidal inductors with Q greater than or equal to 50 at multi-GHz frequencies. With a maximum processing temperature of only 220/spl deg/C, the inductors can be fabricated on top of standard CMOS wafers. This process can also be used to create "inductor chiplets", which are polymer-encapsulated inductors with the same form factor as an EIA (Electronics Industries Association) standard 0201 surface mount device. The chiplets can be assembled onto CMOS wafers using a fluidic microassembly technique. This technique allows for multiple electrical interconnects to the inductor chiplets. The 40-/spl mu/m gap between the substrate and assembled inductor increases the Q by a factor of /spl sim/3 compared to as-fabricated inductors. Assembled and as-fabricated inductors have been characterized on similar substrates and have maximum Q values of 50 and 15 with resonant frequencies of 10 GHz and 9 GHz, respectively. Performance of the assembled inductors is nearly comparable to that of inductors as fabricated and tested on quartz substrates.
Titel: |
High-Performance Inductors Using Capillary Based Fluidic Self-Assembly
|
---|---|
Autor/in / Beteiligte Person: | Scott, K.L. ; Singh, H. ; Hirano, T. ; Niknejad, Ali M. ; Yang, H. ; Howe, Roger T. |
Link: | |
Zeitschrift: | Journal of Microelectromechanical Systems, Jg. 13 (2004-04-01), S. 300-309 |
Veröffentlichung: | Institute of Electrical and Electronics Engineers (IEEE), 2004 |
Medientyp: | unknown |
ISSN: | 1057-7157 (print) |
DOI: | 10.1109/jmems.2003.823234 |
Schlagwort: |
|
Sonstiges: |
|