A model for patterned interfaces debonding – Application to adhesion tests
In: International Journal of Solids and Structures International Journal of Solids and Structures, Elsevier, 2015, 75-76, pp.122-133. ⟨10.1016/j.ijsolstr.2015.08.006⟩; (2015-12-01)
Online
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Zugriff:
International audience; Patterned interfaces are widely used in the industries of microelectronics and micro-electromechanical systems and are of general interest for obtaining specific interface properties by playing on geometry as an additional parameter influencing physical processes (interface engineering). In this paper, a novel analytical model is proposed to characterize the debonding of patterned interfaces. This model is accounting for both stretching and rotation of the finite width bond lines composing a patterning between two plain substrates. The model highlights how the choice of pattern periodicity and line width allows for controlling the interface mechanical behavior during debonding: presence of stable and unstable crack growth regimes. It is shown that models considering a continuum interface are to be used with care when dealing with patterned interfaces. The model proposed here, used in conjunction with an experimental procedure providing the sample bending profile during a wedge test (or a DCB test) should provide valuable guidance for determining the interface fracture energy G, (mode I) for a patterned interface. (C) 2015 Elsevier Ltd. All rights reserved.
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A model for patterned interfaces debonding – Application to adhesion tests
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Autor/in / Beteiligte Person: | Parry, Guillaume ; Cuminatto, Coraly ; Braccini, Muriel ; Science et Ingénierie des Matériaux et Procédés (SIMaP) ; Université Joseph Fourier - Grenoble 1 (UJF)-Centre National de la Recherche Scientifique (CNRS)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut de Chimie du CNRS (INC)-Institut National Polytechnique de Grenoble (INPG) ; SIR, PM |
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Quelle: | International Journal of Solids and Structures International Journal of Solids and Structures, Elsevier, 2015, 75-76, pp.122-133. ⟨10.1016/j.ijsolstr.2015.08.006⟩; (2015-12-01) |
Veröffentlichung: | HAL CCSD, 2015 |
Medientyp: | unknown |
ISSN: | 0020-7683 (print) |
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