A study on the effect of wire bonding interconnects of BCB capped CPW to CPW on LTCC substrate
In: Microwave and Optical Technology Letters Microwave and Optical Technology Letters, Wiley, 2014, 56 (6), pp.1378-1381. ⟨10.1002/mop.28355⟩ Seok, S, Kim, J & Lahti, M 2014, ' A study on the effect of wire bonding interconnects of BCB capped CPW to CPW on LTCC substrate ', Microwave and Optical Technology Letters, vol. 56, no. 6, pp. 1378-1381 https://doi.org/10.1002/mop.28355 Microwave and Optical Technology Letters, 2014, 56 (6), pp.1378-1381. ⟨10.1002/mop.28355⟩
Online
unknown
Zugriff:
The effect of wire bonding interconnects between BCB capped CPW on silicon chip and CPW on low temperature cofired ceramic (LTCC) package is presented. The Si chip is attached onto LTCC package using conductive silver epoxy. Two different bond wires, ribbon-wire and normal wire are used for the transition of CPW–CPW between Si chip and LTCC. The test module has been characterized up to 20 GHz. The CPW lines interconnected with normal wire has insertion loss of 0.6 dB at 5 GHz, while the ribbon wired ones show 0.5 dB at the same frequency. Lumped equivalent circuit model has been developed to figure out the behavior of the test module and three-dimensional HFSS electromagnetic simulation has been also carried out. © 2014 Wiley Periodicals, Inc. Microwave Opt Technol Lett 56:1378–1381, 2014
| Titel: |
A study on the effect of wire bonding interconnects of BCB capped CPW to CPW on LTCC substrate
|
|---|---|
| Autor/in / Beteiligte Person: | Kim, Janggil ; Seok, Seonho ; Lahti, Markku ; Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN) ; Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF) ; Department of Mechanical and Aerospace Engineering [Seoul] ; Seoul National University [Seoul] (SNU) ; VTT Technical Research Centre of Finland (VTT) ; The authors acknowledge the European Union for the funding and support of the FP7 project MEMSPACK (grant agreement no. 223882) |
| Link: | |
| Quelle: | Microwave and Optical Technology Letters Microwave and Optical Technology Letters, Wiley, 2014, 56 (6), pp.1378-1381. ⟨10.1002/mop.28355⟩ Seok, S, Kim, J & Lahti, M 2014, ' A study on the effect of wire bonding interconnects of BCB capped CPW to CPW on LTCC substrate ', Microwave and Optical Technology Letters, vol. 56, no. 6, pp. 1378-1381 https://doi.org/10.1002/mop.28355 Microwave and Optical Technology Letters, 2014, 56 (6), pp.1378-1381. ⟨10.1002/mop.28355⟩ |
| Veröffentlichung: | HAL CCSD, 2014 |
| Medientyp: | unknown |
| ISSN: | 0895-2477 (print) ; 1098-2760 (print) |
| Schlagwort: |
|
| Sonstiges: |
|