Eva-CiM: A System-Level Performance and Energy Evaluation Framework for Computing-in-Memory Architectures
2019
Online
report
Computing-in-Memory (CiM) architectures aim to reduce costly data transfers by performing arithmetic and logic operations in memory and hence relieve the pressure due to the memory wall. However, determining whether a given workload can really benefit from CiM, which memory hierarchy and what device technology should be adopted by a CiM architecture requires in-depth study that is not only time consuming but also demands significant expertise in architectures and compilers. This paper presents an energy evaluation framework, Eva-CiM, for systems based on CiM architectures. Eva-CiM encompasses a multi-level (from device to architecture) comprehensive tool chain by leveraging existing modeling and simulation tools such as GEM5, McPAT [2] and DESTINY [3]. To support high-confidence prediction, rapid design space exploration and ease of use, Eva-CiM introduces several novel modeling/analysis approaches including models for capturing memory access and dependency-aware ISA traces, and for quantifying interactions between the host CPU and CiM modules. Eva-CiM can readily produce energy estimates of the entire system for a given program, a processor architecture, and the CiM array and technology specifications. Eva-CiM is validated by comparing with DESTINY [3] and [4], and enables findings including practical contributions from CiM-supported accesses, CiM-sensitive benchmarking as well as the pros and cons of increased memory size for CiM. Eva-CiM also enables exploration over different configurations and device technologies, showing 1.3-6.0X energy improvement for SRAM and 2.0-7.9X for FeFET-RAM, respectively.
Comment: 13 pages, 16 figures
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Eva-CiM: A System-Level Performance and Energy Evaluation Framework for Computing-in-Memory Architectures
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Autor/in / Beteiligte Person: | Gao, Di ; Reis, Dayane ; Hu, Xiaobo Sharon ; Zhuo, Cheng |
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Veröffentlichung: | 2019 |
Medientyp: | report |
DOI: | 10.1109/TCAD.2020.2966484 |
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