Improving off-state capacitance of SOI-CMOS RF switches: how good are air microcavities?
In: Proceedings of the IEEE 53rd European Solid-State Device Research Conference, ESSDERC ; IEEE 53rd European Solid-State Device Research Conference, 2023
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International audience ; This paper investigates the reduction of the off-state capacitance (COFF) of SOI-CMOS RF switches induced by the introduction of air microcavity in the back-end interconnection network. A detailed methodology combining electromagnetic and semiconductor transport simulations is used to separately evaluate the respective contributions of the interconnects and junction capacitances. A baseline switch and an optimized version of the same are studied to evaluate their ability to take advantage of air microcavities. Simulations show a reduction of 73 fF/mm regardless of the switch structure considered, resulting in a 24.6% and 30.6% improvement in COFF for baseline and optimized switches, respectively, bringing the optimized version to a 60fs record Ron × Coff. This concept was experimentally implemented using a partial etch process that resulted in a reduction of 21.7 fF/mm, i.e., 7.2%. Finally, the implementation of a more isotropic and selective etching process using HF in vapor phase is shown to approach the optimal configuration of air microcavities.
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Improving off-state capacitance of SOI-CMOS RF switches: how good are air microcavities?
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Autor/in / Beteiligte Person: | Gheysens, Daniel ; Fleury, Alain ; Monfray, Stéphane ; Gianesello, Frédéric ; Cathelin, Philippe ; Robillard, Jean-François ; Troadec, David ; Dubois, Emmanuel ; STMicroelectronics Crolles (ST-CROLLES) ; STMicroelectronics ; Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN) ; Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA) ; Université catholique de Lille (UCL)-Université catholique de Lille (UCL) ; Microélectronique Silicium - IEMN (MICROELEC SI - IEMN) ; Université catholique de Lille (UCL)-Université catholique de Lille (UCL)-Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA) ; Centrale de Micro Nano Fabrication - IEMN (CMNF - IEMN) ; STMicroelectronics-IEMN joint laboratory ; renatech ; National Research Agency (ANR) under program PIA EQUIPEX LEAF ANR-11-EQPX-0025 ; Network, Renatech ; CMNF ; Laboratoire commun STMicroelectronics-IEMN T4 ; CPER, IMITECH ; ANR-11-EQPX-0025,LEAF,Plateforme de traitement laser pour l'électronique flexible multifonctionnelle(2011) |
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Zeitschrift: | Proceedings of the IEEE 53rd European Solid-State Device Research Conference, ESSDERC ; IEEE 53rd European Solid-State Device Research Conference, 2023 |
Veröffentlichung: | HAL CCSD ; IEEE, 2023 |
Medientyp: | Konferenz |
DOI: | 10.1109/ESSDERC59256.2023.10268524 |
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