A D-band multi-channel Tx System-in-Package achieving 84.48 Gb/s with 64-QAM based on 45nm CMOS and low-Cost PCB technology

This paper is an expanded version from the 2021 IEEE RFIC Symposium, Atlanta, GA, USA, June 7-9, 2021 ; International audience ; A high data-rate D-band transmitter module cointegrating a dual channel transmitter IC in 45 nm CMOS PDSOI technology and an antenna is presented. The proposed system-inpackage is based on an innovative channel bonding technique and is fabricated using a low-cost printed circuit board process. The IC consists of two up-conversion chains including on-chip millimeter-wave local oscillator generators. The emitted signal is composed of eight channels, each one having 2.16 GHz bandwidth, organized in two sets of 4 channels at the IF band (around 61.56 GHz) that are up-converted to two adjacent sub-bands centered at 148 GHz. Then, the two sub-band signals are combined off-chip using a substrate integrated waveguide diplexer and radiated by a patch antenna array realized on the same package. The output spans from 139.3 to 156.6 GHz. The total equivalent isotropic radiated power is 8.3 dBm. A 84.48 Gb/s data rate is achieved with 64 QAM. The module consumes 600 mW from a 1-V supply and occupies a compact area of 12×6 mm$^2$ .