Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards
In: Microelectronics Reliability ; volume 75, page 27-36 ; ISSN 0026-2714, 2017
academicJournal
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Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards
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Autor/in / Beteiligte Person: | Hua, L. ; Hou, H.N. ; Hubei Provincial Key Laboratory of Plant Anti-cancer Active Substance Purification and Application ; Hubei Provincial Department of Education |
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Zeitschrift: | Microelectronics Reliability ; volume 75, page 27-36 ; ISSN 0026-2714, 2017 |
Veröffentlichung: | Elsevier BV, 2017 |
Medientyp: | academicJournal |
DOI: | 10.1016/j.microrel.2017.06.005 |
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