Patent Issued for Packaging Optoelectronic Components and CMOS Circuitry Using Silicon-On-Insulator Substrates for Photonics Applications (USPTO 9786641).
In: Computer Weekly News, 2017-10-25, S. 2363
Zeitungsartikel
Zugriff:
Titel: |
Patent Issued for Packaging Optoelectronic Components and CMOS Circuitry Using Silicon-On-Insulator Substrates for Photonics Applications (USPTO 9786641).
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Zeitschrift: | Computer Weekly News, 2017-10-25, S. 2363 |
Veröffentlichung: | 2017 |
Medientyp: | Zeitungsartikel |
ISSN: | 1944-1592 (print) |
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