Thermal Characterization of a Multilayer 313 Plastic Ball Grid Array Device : International flip chip, ball grid array, TAB and advanced packaging symposium
Konferenz
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Thermal Characterization of a Multilayer 313 Plastic Ball Grid Array Device : International flip chip, ball grid array, TAB and advanced packaging symposium
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Autor/in / Beteiligte Person: | Briar, J. ; Bond, B. ; Freyman, B. ; Hundt, M. |
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Medientyp: | Konferenz |
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