Interconnect and Packaging Technology for CMOS Image Sensors (Invited) : International conference on solid state devices and materials
In: SOLID STATE DEVICES AND MATERIALS; (2008) S. 910-911
Konferenz
Zugriff:
Titel: |
Interconnect and Packaging Technology for CMOS Image Sensors (Invited) : International conference on solid state devices and materials
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Autor/in / Beteiligte Person: | Gambino, J. ; Leidy, B. ; Rassel, R.J. ; Adkisson, J. ; Ellis-Monaghan, J. ; Musante, C. ; Ackerson, K. ; Guthrie, B. ; Abadeer, W. ; Meatyard, D. |
Link: | |
Quelle: | SOLID STATE DEVICES AND MATERIALS; (2008) S. 910-911 |
Veröffentlichung: | 2008 |
Medientyp: | Konferenz |
ISBN: | 978-4-903968-61-2 (print) ; 4-903968-61-8 (print) |
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